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个人简介
Jungwon Lee (M’05–SM’12–F’18) is a Vice President at Samsung SoC Lab in San Diego, CA, in charge of cellular and multimedia R&D. From 2003 to 2010, he was with Marvell Semiconductor, Inc., where he developed HD Radio, Bluetooth, Wi-Fi, WiMAX, and LTE chips. Since 2010, he has been with Samsung USA, developing wireless chips such as cellular modems, Wi-Fi, Bluetooth, ZigBee, and GNSS and multimedia solutions. He is currently conducting research on 5G NR and AI. He has co-authored more than 100 papers and holds over 300 patents in the US and about 1000 patents worldwide. Dr. Lee is an IEEE Fellow.
研究兴趣
论文共 481 篇作者统计合作学者相似作者
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IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGYno. 1 (2024): 13-28
JOURNAL OF FOOD MEASUREMENT AND CHARACTERIZATIONno. 1 (2024): 764-771
Sascha Trippe,Taehyun Jung,Jung-Won Lee, Jan Wagner, Jeong-Yeol Han, Wonseok Kang, Jae-Hyun Kyeong,Jae-Young Kim,Jongho Park,Jeffrey A. Hodgson
arXiv (Cornell University) (2023)
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arXiv (Cornell University) (2023)
Pietro Bolli,Seog-Tae Han, Jihoon Choi,Alessandro Orfei, Ignazio Porceddu,Do-Young Byun,Alessandro Cattani,Moon-Hee Chung,Franco Fiocchi,Francesco Gaudiomonte,Do-Heung Je,Adelaide Ladu,
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS)pp.1-5, (2023)
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VTC2023-Springpp.1-7, (2023)
Han-guksikpumjeojang-yutonghakoejino. 1 (2023): 1-14
2022 19th International SoC Design Conference (ISOCC)pp.57-58, (2022)
2022 IEEE 95th Vehicular Technology Conference: (VTC2022-Spring)pp.1-5, (2022)
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