Design and Implementation of Broadband Cermet Package Low Noise Amplifier
2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE)(2022)
摘要
Based on the GaAs pHEMT monolithic process and miniaturized cermet packaging process, a high-integration, wide-band, cermet package low noise amplifier (LNA) is successfully implemented. In the 10 GHz ~20 GHz band, the port standing wave is less than 1.5, the gain is more than 15 dB, the noise figure is less than 2.8 dB, and the package size is only 4.0 mm*4.0 mm*1.2 mm. The research and development of broadband cermet package LNA will push the receiver to realize higher integration, smaller array area, and improve its frequency utilization and anti-interference ability.
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关键词
LNA,GaAs,Broadband,Cermet package
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