We extend our previous works on downstream 100G/λ C-band IM-DD PON using slot-by-slot CD precompensation by experimentally demonstrating a novel solution for supporting 0-20 km differential distance including a common header field.
We experimentally demonstrate a deep unfolding approach for parameter optimization in MIMO adaptive equalization with separated carrier phase estimation and frequency offset compensation, achieving a significant reduction in optimization cost while attaining optimal equalization performance.
We present a 19-core-MCF-coupled co-packaged optical chiplet integrating backside-emitting VCSEL and backside-illuminated PD arrays flip-bonded to driver–TIA EICs. Fundamental optical performance and thermal-path feasibility are demonstrated, with envisioned scalability toward multi-chiplet GPU optical interconnects.
Deep learning enables geometric sensing for efficient profiling applications. We present a surface profiler based on a codesigned encoder-decoder pair consisting of reconfigurable integrated sampler and 1D-CNN, achieving ~17µm vertical and ~30µm lateral accuracy, respectively.
