NOVELTY - A lead-free alloy comprises (wt.%) copper (0.1-3), phosphorus (0.001-0.1), optionally germanium (0.001-0.1), optionally strength-improving element(s), optionally melting point-lowering elements, and tin (balance).
USE - The alloy is used for soldering electronic components to printed wiring boards. It is used for performing flow soldering, and for forming a soldered joint (claimed).
ADVANTAGE - The alloy has an excellent solderability.
DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method of performing flow soldering comprising using a lead-free solder alloy.