专

一种压气机可控扩散叶型稳健优化设计方法

1262012051989A1

发明人

高丽敏, 蔡宇桐, 李瑞宇, 高磊, 曾瑞慧

受让人

UNIV NORTHWESTERN POLYTECHNICAL (UNWP-C)

申请人

STI Holdings Inc.

申请号

11741103

申请日

2011-07-27

公开(公告)号

1262012051989A1

公开(公告)日

1990-03-13

IPC分类号

A61B001/00A61M001/06

CPC分类号

优先权号

DM/072949

优先权日

2010-01-21

摘要

There is provided an image forming apparatus includes an apparatus body having an opening, an open/close member which opens and closes the opening, and an image forming unit which is drawable to an outside of the apparatus body through the opening. The open/close member includes a restraint member which is movable between a restraint position of restraining movement of the image forming unit and a restraint release position of releasing the restraint, and a moving member which moves the restraint member from the restraint position toward the restraint release position as the open/close member being moved from a close position to an open position. Once the restraint member is moved from the restraint position toward the restraint release position, the restraint member is held at the restraint release position not to be moved from the restraint release position to the restraint position even when the open/close member is moved.

权利要求

1 . A method for implementing enhanced customized printed circuit board (PCB) via creation during printed circuit board (PCB) manufacturing comprising: providing a printed circuit board (PCB); forming a via extending through the printed circuit board (PCB); rendering at least one magnetic pad into the via before aqueous seed and plate processing in the PCB manufacture; performing PCB aqueous seed and plate processing, and said magnetic pad selectively rendering copper in at least one selected region of the via.

2 . The method as recited in claim 1 wherein rendering at least one magnetic pad includes rendering at least one magnetic pad by an inner-layer PCB processing step.

3 . The method as recited in claim 2 includes accomplishing said at least one magnetic pad rendering using an existing PCB manufacturing method.

4 . The method as recited in claim 1 wherein rendering at least one magnetic pad includes forming at least one magnetic capture pad.

5 . The method as recited in claim 4 includes forming said at least one magnetic capture with ferrous seed material.

6 . The method as recited in claim 5 wherein rendering at least one magnetic pad includes providing said ferrous seed material for prohibiting a seed layer from forming in the via barrel outside of an intended area with the seed material being captive by aqueous magnetic material with said at least one magnetic pad.

7 . The method as recited in claim 1 wherein rendering at least one magnetic pad includes forming at least one magnetic anti-pad.

8 . The method as recited in claim 7 includes forming said at least one magnetic anti-pad with ferrous resist material.

9 . The method as recited in claim 1 wherein said at least one magnetic pad includes at least one magnetic capture pad, and performing PCB aqueous seed and plate processing includes said plating process rendering copper substantially only in the region captive by said at least one magnetic capture pad.

10 . The method as recited in claim 1 includes PCB aqueous seed and plate processing includes said plating process rendering copper substantially only in the region outside an intended area of the magnetic anti-pad.

11 . The method as recited in claim 1 wherein said magnetic pads include magnetic capture pads and further includes reversing the polarity of the magnetic capture pads whereby said magnetic capture pads reject seeding capability beyond the intended layer.

12 . The method as recited in claim 11 includes lowering the PCB into a bath from one edge and whereby said magnetic capture pads reside at a stop layer, opposite an external surface lowered into the bath first.

13 . The method as recited in claim 1 includes performing conventional PCB finishing processes.

14 . A structure for implementing enhanced via creation without creating a via barrel stub during printed circuit board (PCB) manufacturing comprising: a printed circuit board (PCB); said printed circuit board (PCB) including a via; said via extending through the printed circuit board (PCB); a plurality of magnetic pads contained in said via; and plating covering an intended area of the via, said plurality of magnetic pads eliminating via barrel stub creation during PCB manufacturing.

15 . The structure as recited in claim 14 wherein said plurality of magnetic pads rendered by an inner-layer PCB processing step.

16 . The structure as recited in claim 14 wherein said plurality of magnetic pads includes at least one magnetic capture pad.

17 . The structure as recited in claim 16 wherein said plurality of magnetic pads is formed with ferrous seed material.

18 . The structure as recited in claim 17 wherein said ferrous seed material prohibits a seed layer from forming in a via barrel outside of intended area with the seed material being captive by an aqueous magnetic material.

19 . The structure as recited in claim 14 wherein said plurality of magnetic pads includes at least one magnetic anti-pad.

20 . The structure as recited in claim 19 wherein said plurality of magnetic pads is formed with ferrous resist material.

说明书

[0001]FIG. 1 is a front elevation view of the present design. FIG. 2 is a left side elevation view of the present design; FIG. 3 is a right side elevation view of the present design; FIG. 4 is a bottom view of the present design; FIG. 5 is a top view of the present design; and, FIG. 6 is a rear elevation view of the present design.

同族专利

暂无同族专利