基本信息
浏览量:4
职业迁徙
个人简介
Kai-Ming Yang received the B.S. degree from the Industrial Engineering Department, Da Yeh University, Changhua, Taiwan, in 2001.
Since 2010, he has been with the Unimicron Technology Corporation, Taoyuan City, Taiwan, where he is currently the Deputy Manager and In Charge of the New Business Development Division under CEO Office, where he was involved in the integrated embedded interposer carrier substrate technology development. He is also currently in charge of the fan-out panel-level packaging substrate and assembly technology development.
研究兴趣
论文共 22 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
John H. Lau,Curry Lin,Hsing-Ning Liu,Kai-Ming Yang,Tim Xia,Cheng-Ta Ko,Bruce Puru Lin, Yu-Ling Chuang,R. Chen, M. Ma,Tzyy-Jang Tseng,Ming Li,K. Leung
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 9 (2023): 1371-1379
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 3 (2022): 469-478
International Symposium on Microelectronicsno. 1 (2021): 000217-000223
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.885-894, (2021)
John H. Lau, Cheng-Ta Ko,Chia-Yu Peng,Kai-Ming Yang,Tim Xia,Puru Bruce Lin, Jean-Jou Chen,Po-Chun Huang,Tzvy-Jang Tseng,Eagle Lin,Leo Chang,Curry Lin,Yan-Jun Fan,Hsing-Ning Liu, Winnie Lu
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.359-364, (2021)
Journal of microelectronics and electronic packagingno. 2 (2021): 67-80
Journal of microelectronics and electronic packagingno. 2 (2021): 29-39
2021 IEEE CPMT Symposium Japan (ICSJ)pp.5-8, (2021)
加载更多
作者统计
#Papers: 22
#Citation: 64
H-Index: 5
G-Index: 6
Sociability: 4
Diversity: 1
Activity: 2
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn