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个人简介
Currently, working on advanced semiconductor packaging at the 3D Systems Packaging Research Center (PRC), Georgia Tech.
研究兴趣
论文共 15 篇作者统计合作学者相似作者
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Emanuel Torres Surillo,Ramón A. Sosa, Christian Molina, Hyunggyu Park,Pratik Nimbalkar, Sriram Srirangan, Lila D. Dahal, Yongwon Lee,Vanessa Smet
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.246-253, (2024)
Mohanalingam Kathaperumal,Pragna Bhaskar, Austin J. Toro,Pratik Nimbalkar, Lila Dahal,Muhannad S. Bakir
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1958-1962, (2024)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.147-151, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1603-1608, (2023)
IEEE transactions on components, packaging, and manufacturing technologyno. 3 (2023): 291-299
IEEE transactions on device and materials reliabilityno. 1 (2022): 59-64
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1674-1679, (2022)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2022)
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.983-988, (2021)
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作者统计
#Papers: 15
#Citation: 81
H-Index: 5
G-Index: 8
Sociability: 3
Diversity: 0
Activity: 0
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D-Core
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