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论文共 135 篇作者统计合作学者相似作者

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Structural Assessment of Silver Conductive Ink using Nanoindentation
Zuraihana Bachok,Abdullah Aziz Saad,Sana Zulfiqar,Aizat Abas, Mohamad Danial Shafiq, Muhammad Fadhirul Izwan Abdul Malik
Journal of Current Science and Technologyno. 2 (2024)
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Effect of Dispensing Type On Void Formation Using Convolutional Neural Network
Muhammad Taufik Azahari, Calvin Ling,Mohamad Aizat Abas,Fei Chong Ng
Journal of Electronic Packagingpp.1-28, (2024)
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Investigating the impact of different solder alloy materials during laser soldering process
Zuraihana Bachok,Aizat Abas, Hooi Feng Tang, Muhammad Zaim Hanif Nazarudin, Mohamad Fikri Mohd Sharif,Fakhrozi Che Ani
Soldering & Surface Mount Technology (2024)
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Deformation and crack growth in multilayered ceramic capacitor during thermal reflow process: numerical and experimental investigation
Rilwan Kayode Apalowo,Mohamad Aizat Abas,Zuraihana Bachok, Mohamad Fikri Mohd Sharif,Fakhrozi Che Ani,Mohamad Riduwan Ramli, Muhamed Abdul Fatah bin Muhamed Mukhtar
MICROELECTRONICS INTERNATIONAL (2024)
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Correlation Study On Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning
Calvin Ling, Taufik Azahari,Mohamad Aizat Abas,Fei Chong Ng
Journal of Electronic Packagingpp.1-15, (2024)
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Deep learning and analytical study of void regional formation in flip-chip underfilling process
Calvin Ling, Muhammad Taufik Azahari,Mohamad Aizat Abas,Fei Chong Ng
SOLDERING & SURFACE MOUNT TECHNOLOGYno. 1 (2024): 60-68
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Performance of power dissipation on semiconductor module for different configuration of heat SINK with thermal pad
Muhammad Razin Salim,Aizat Abas, Kah Hei Lim, Mohamad Nazir Abdullah
International Journal of Thermal Sciences (2024): 109045
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