Aleksandar Radisic

IMEC, Kapeldreef 75, B-3001 Heverlee, Leuven, Belgium

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Papers53 papers

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Copper Rich Cu1-xNix Alloys (0.05 < x < 0.15) Electrodeposited from Acid Sulfate-Based Electrolyte with Benzotriazole Additive for Microbump Metallization for 3D Stacked Integrated Circuits

Karel P. S. Haesevoets,Aleksandar Radisic,Philippe M. Vereecken

Journal of The Electrochemical Society, no. 8 (2019)

Bibtex

Nanometer-Thin Graphitic Carbon Buffer Layers for Electrolytic MnO2for Thin-Film Energy Storage Devices

Stella Deheryan, Yafa Zargouni, Rochan Sinha,Brecht Put,Aleksandar Radisic,Marc Heyns,Philippe M. Vereecken

Journal of The Electrochemical Society, no. 2 (2017)

Cited by3Bibtex

The effect of the substrate characteristics on the electrochemical nucleation and growth of copper

Magi Margalit Nagar,Aleksandar Radisic, Katrien Strubbe,Philippe M. Vereecken

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, no. 12 (2016): D3053-D3061

Bibtex

The limitation and optimization of bottom-up growth mode in through silicon via electroplating

Liu Yang,Liu Yang,Aleksandar Radisic,Johan Deconinck,Philippe M. Vereecken

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, no. 14 (2015): D599-D604

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Electrochemical Deposition of Platinum Interconnects on Flexible Biocompatible Substrates

Aleksandar Radisic, B M Morcos,M Op De Beeck, J M O Callaghan,C Van Hoof

(2014)

Cited by1Bibtex

Electrochemical fabrication of platinum interconnects for implantable electronic devices

Aleksandar Radisic, B M Morcos,M Op De Beeck, J M O Callaghan,C Van Hoof

Microelectronic Engineering, (2014): 251-256

Cited by2Bibtex

Effect of Film Morphology on the Li Ion Intercalation Kinetics in Anodic Porous Manganese Dioxide Thin Films

A S Etman,Aleksandar Radisic, Mahmoud M Emara,Cedric Huyghebaert,Philippe M Vereecken

Journal of Physical Chemistry C, (2014)

Cited by10Bibtex

(Invited) Wafer Scale Copper Direct Plating on Thin PVD RuTa Layers: A Route to Enable Filling 30 nm Features and Below

Silvia Armini, Z Elmekki, Magi Margalit Nagar,Aleksandar Radisic, W Ruythooren,Philippe M Vereecken

(2014)

Bibtex

Electrodeposition and Characterization of Manganese Dioxide Thin Films on Silicon Pillar Arrays for 3D Thin-Film Lithium-Ion Batteries

Philippe M Vereecken,Cedric Huyghebaert, Khaled Alouani, S Rochan,Daire J Cott,Aleksandar Radisic, S Deheryan, Y Zargouni

(2014)

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Direct Copper Plating

Aleksandar Radisic,Philippe M Vereecken

(2014)

Bibtex

The Effect of Polyether Suppressors on the Nucleation and Growth of Copper on RuTa Seeded Substrate for Direct Copper Plating

Magi Margalit Nagar,Aleksandar Radisic,Katrien Strubbe,Philippe M Vereecken

Electrochimica Acta, (2014): 315-326

Cited by2Bibtex

Stochastic Modeling of Polyethylene Glycol as a Suppressor in Copper Electroplating

Liu Yang,Aleksandar Radisic,Johan Deconinck,Philippe M Vereecken

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, no. 5 (2014): D269-D276

Bibtex

Wafer Scale Copper Direct Plating on Thin PVD RuTa Layers: A Route to Enable Filling 30 nm Features and Below

Silvia Armini,Z Elmekki, Magi Margalit Nagar,Aleksandar Radisic,Philippe M Vereecken

Journal of The Electrochemical Society, (2014)

Bibtex

Electrochemical Deposition of Manganese Oxides on Carbon Nanosheets

Y Zargouni, S Deheryan, A S Etman,Daire J Cott,Philippe M Vereecken,Aleksandar Radisic

(2014)

Bibtex

Modeling the Bottom-Up Filling of Through-Silicon vias Through Suppressor Adsorption/Desorption Mechanism

Liu Yang,Aleksandar Radisic,Johan Deconinck,Philippe M Vereecken

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, no. 12 (2013): D3051-D3056

Cited by15Bibtex

Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias

Fumihiro Inoue,Harold Philipsen,Aleksandar Radisic,Silvia Armini,Yann Civale,Peter Leunissen, Muneharu Kondo, Eric Webb,Shoso Shingubara

Electrochimica Acta, (2013): 203-211

Cited by31Bibtex

Wafer-scale Cu plating uniformity on thin Cu seed layers

Liu Yang, Tanya A Atanasova,Aleksandar Radisic,Johan Deconinck,Alan C West,Philippe M Vereecken

Electrochimica Acta, (2013): 242-248

Cited by6Bibtex

The effect of cupric ion concentration on the nucleation and growth of copper on RuTa seeded substrates

Magi Margalit Nagar,Aleksandar Radisic,Katrien Strubbe,Philippe M Vereecken

Electrochimica Acta, (2013): 474-483

Cited by11Bibtex

Nucleation and growth of copper on Ru-based substrates, II: the effect of the suppressor additive

Magi Margalit Nagar,Aleksandar Radisic,Katrien Strubbe,Philippe M Vereecken

ECS Transactions, no. 35 (2012): 99-110

Cited by6Bibtex

The Bottom-Up Copper Fill of O5[micro sign]m × 40[micro sign]m Vias Using 2-Component Model Chemistry

Hugo Bender, Christel Drijbooms, Liu Yang,Aleksandar Radisic

(2012)

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Aleksandar RadisicBinding

Papers53 papers

Aleksandar Radisic