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She has been with the IBM T. J. Watson Research Center, Yorktown Heights, NY, since 1971 and retired after 38 years in 2009. She worked in several areas, including testing of semiconductor and magnetic bubble memory devices. She designed unique lossy transmission line configurations, and developed unique high-frequency high-impedance coaxial probes as well as a novel short-pulse measurement technique for characterization of resistive transmission lines. She was a Research Staff Member working on the design, analysis, and measurement of packaging and very large scale integration chip interconnections for future digital processor and communication applications. Her work involved 3-D modeling, signal integrity and noise simulation, and testing of a large range of package lossy transmission lines from printed-circuit boards, cables, connectors, to thin-film wiring on multichip modules and on-chip wiring. She also managed the Interconnect and Packaging Analysis Project that develops advanced electromagnetic field-solver codes. She has authored 46 papers published in refereed technical journals, has given numerous invited and tutorial talks, and holds 16 patents.,Dr. Deutsch received the Outstanding Technical Achievement, Research Division, and S/390 Division Team Awards from IBM in 1990, 1993, 1996, 1999–2003, 2005, 2006, and 2009. She co-chaired the IEEE Topical Meeting on Electrical Performance of Electronic Packaging for four years, was Technical Program Co-Chair for the International Microelectronics and Packaging Society Next Generation Integrated Circuit (IC) and Package Design Workshop for three years, co-chaired the Components, Packaging & Manufacturing Technology (CPMT) Society Future Directions in IC and Package Design workshop for six years, served as Guest Editor of the IEEE Transactions on Advanced Packaging for five years, and was an Associate Editor of the IEEE Transactions on Components and Packaging Technologies. She is a member of Tau Beta Pi and Eta Kappa Nu. She has served as an elected member of the IEEE CPMT Society Board of Governors for 2000 to 2002 and Vice-Chair of the CPMT Society Electrical Design, Modeling, and Simulation Technical Committee.