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Ahmad E. Islam,Nicholas P. Sepelak, Adam T. Miesle,Hanwool Lee,Michael Snure, Stefan Nikodemski,Dennis E. Walker, Nicholas C. Miller,Matt Grupen,Kevin D. Leedy,Kyle J. Liddy,Antonio Crespo,
IEEE Transactions on Electron Devicesno. 99 (2024): 1-7
IMAPS symposia and conferencesno. HiTEN (2023)
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Ahmad E. Islam,Matt Grupen, Gary Hughes,Andreas Popp,Nicholas P. Sepelak,Kevin D. Leedy,Thaddeus Asel,Wenjuan Zhu, Adam T. Miesle,Kyle J. Liddy,Adam Neal,Brian Poling,
NAECON 2023 - IEEE National Aerospace and Electronics Conferencepp.263-268, (2023)
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APPLIED PHYSICS LETTERSno. 17 (2023)
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Jeremiah Williams,Nolan S. Hendricks,Weisong Wang, Aaron Adams, Joshua Piel,Daniel Dryden,Kyle J. Liddy,Nicholas Sepelak, Bradley Morell,Adam Miesle,Ahmad Islam,Andrew J. Green
DRCpp.1-2, (2023)
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APPLIED PHYSICS EXPRESSno. 7 (2023): 071002-071002
S. Ahmed, A. Islam, D. Dryden,Kyle J. Liddy,Nolan S. Hendricks,Neil A. Moser,Kelson D. Chabak,Andrew J. Green
DRCpp.1-2, (2023)
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Jeremiah Williams,Nolan Hendricks,Weisong Wang, Aaron Adams, Joshua Piel,Daniel Dryden,Kyle Liddy,Nicholas Sepelak, Bradley Morell, Adam Miesle,Ahmad Islam,Andrew Green
2023 Device Research Conference (DRC)pp.1-2, (2023)
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Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials (2023)
Meeting abstractsno. 32 (2023): 1824-1824
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