Anthony K Stamper

Microelectron. Div., IBM, Essex Junction, VT, USA|c|

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Papers15 papers

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BACK-END-OF-LINE METAL-OXIDE-SEMICONDUCTOR VARACTORS

John J Ellismonaghan, Michael J Hauser, Zhongxiang He, Xuefeng Liu, Richard A Phelps,Robert M Rassel,Anthony K Stamper

(2014)

Bibtex

Method of making heat sink for integrated circuit devices

Douglas D Coolbaugh, Ebenezer E Eshun,Terence B Hook,Robert M Rassel,Edmund J Sprogis,Anthony K Stamper,William J Murphy

(2014)

Bibtex

High-resistivity SiGe BiCMOS technology development

Anthony K Stamper,Renata Camillocastillo,Hanyi Ding,James S Dunn,Mark D Jaffe,Vibhor Jain,Alvin J Joseph, Ian Mccallumcook,K M Newton,Shyam Parthasarathy,Robert M Rassel,Michael J Zierak

Bipolar/BiCMOS Circuits and Technology Meeting, pp.25-28, (2014)

Cited by3EIWOSBibtex

Method of forming MIM capacitor structure in FEOL

Douglas D Coolbaugh, Ebenezer E Eshun,Robert M Rassel,Anthony K Stamper

(2013)

Cited by1Bibtex

Process for single and multiple level metal-insulator-metal integration with a single mask

Anil K Chinthakindi,Douglas D Coolbaugh, Keith E Downes, Ebenezer E Eshun, Zhongxiang He,Robert M Rassel,Anthony K Stamper

(2012)

Cited by2Bibtex

INTEGRATED STRUCTURES OF HIGH PERFORMANCE ACTIVE DEVICES AND PASSIVE DEVICES

Robert M Rassel,Anthony K Stamper, Daniel S Vanslette

(2012)

Cited by1Bibtex

METHOD OF FABRICATING A PRECISION BURIED RESISTOR

Anil K Chinthakindi,Douglas D Coolbaugh, Keith E Downes, Ebenezer E Eshun, J Florkey, Heidi L Greer,Robert M Rassel,Anthony K Stamper,Kunal Vaed

(2011)

Cited by5Bibtex

MIM CAPACITOR STRUCTURE IN FEOL AND RELATED METHOD

Douglas D Coolbaugh, Ebenezer E Eshun,Robert M Rassel,Anthony K Stamper

(2011)

Cited by3Bibtex

Changing an electrical resistance of a resistor

Arne W Ballantine, Cyril Cabral,Daniel C Edelstein,Anthony K Stamper

(2010)

Cited by3Bibtex

Method of Integration of a MIM Capacitor with a Lower Plate of Metal Gate Material Formed on an STI Region or a Silicide Region Formed in or on the Surface of a Doped Well with a High K Dielectric Material

Anil K Chinthakindi,Douglas D Coolbaugh, Keith E Downes, Ebenezer E Eshun, Zhongxiang He,Robert M Rassel,Anthony K Stamper,Kunal Vaed

(2009)

Cited by5Bibtex

Method for forming an on-chip high frequency electro-static discharge device

Hanyi Ding, Kai D Feng,Zhongxiang He,Xuefeng Liu,Anthony K Stamper

(2009)

Bibtex

TERMINAL PAD STRUCTURES AND METHODS OF FABRICATING SAME

Douglas D Coolbaugh, Daniel C Edelstein, Ebenezer E Eshun, Zhongxiang He,Robert M Rassel,Anthony K Stamper

(2008)

Cited by19Bibtex

Integration of a MIM capacitor with a plate formed in a well region and with a high-k dielectric

Anil K Chinthakindi,Douglas D Coolbaugh, Keith E Downes, Ebenezer E Eshun, Zhongxiang He,Robert M Rassel,Anthony K Stamper,Kunal Vaed

(2008)

Cited by5Bibtex

Heat sink for integrated circuit devices

Douglas D Coolbaugh, Ebenezer E Eshun,Terence B Hook,Robert M Rassel,Edmund J Sprogis,Anthony K Stamper,William J Murphy

(2007)

Cited by2Bibtex

Method for changing an electrical resistance of a resistor

Arne W Ballantine, Cyril Cabral,Daniel C Edelstein,Anthony K Stamper

(2003)

Cited by6Bibtex

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Anthony K StamperBinding

Papers15 papers

Anthony K Stamper