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个人简介
Bibhu Prasad Nayak (M’13) was born in Cuttack, India, in 1980. He received the B.E. degree in electronics and telecommunication engineering from the University College of Engineering, Sambalpur University, Orissa, India, in 2002, and the M.Tech. degree in microwave and photonics from IIT Kanpur, Kanpur, India, in 2005. He is currently pursuing the Ph.D. degree at the Department of Electrical Communication Engineering, Indian Institute of Science, Bengaluru, India, as a sponsored candidate.
He was with the Indian Space Research Organization, Bengaluru, from 2005 to 2007. Since 2007, he has been involved in electromagnetic compatibility (EMC) simulations for automotive products at Robert Bosch Engineering and Business Solutions, Bengaluru. His current research interests include 2.5-D methods, hybridization of computational techniques for system simulation, electromagnetic interference/EMC, and antenna design/analysis.
研究兴趣
论文共 25 篇作者统计合作学者相似作者
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2023 JOINT ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND INTERNATIONAL CONFERENCE ON ELECTROMAGNETIC INTERFERENCE & COMPATIBILITY, APEMC/INCEMICpp.1-5, (2023)
IEEE Journal on Multiscale and Multiphysics Computational Techniques (2023): 269-280
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2023 JOINT ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND INTERNATIONAL CONFERENCE ON ELECTROMAGNETIC INTERFERENCE & COMPATIBILITY, APEMC/INCEMICpp.1-4, (2023)
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Jie Chen,Rajen Murugan, John Broze, Premsagar Kittur, Bryan Marshall, Tilden Chen, Alex Triano,Bibhu Nayak, Harikiran Muniganti, Joe Sivaswamy,Dipanjan Gope
2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2023)
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)pp.570-574, (2022)
Jie Chen,Rajen Murugan, Sooping Saw, Francisco Lauzurique, John Broze, Craig Greenberg, Alex Triano,Bibhu Nayak,Harikiran Muniganti, Joe Sivaswamy,Dipanjan Gope
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2022)
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)pp.1-4, (2021)
international symposium on electromagnetic compatibilitypp.1-4, (2021)
international symposium on electromagnetic compatibilitypp.1-4, (2021)
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