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Dang, B.

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Techniques for forming solder bump interconnects

Bing Dang, Peter A Gruber, Luc Guerin,Chirag S Patel

(2012)

Cited by6Bibtex

Silicon carrier optoelectronic packaging

Paul S Andry,Russell A Budd,Bing Dang, David Danovitch,Benjamin V Fasano, Paul Fortier, Luc Guerin,Frank R Libsch, Sylvain Ouimet,Chirag S Patel

(2011)

Bibtex

3D silicon integration

John U Knickerbocker,Paul S Andry,Bing Dang,R R Horton,Chirag S Patel,R J Polastre, Katsuyuki Sakuma, E Sprogis,Cornelia K Tsang,Bucknell C Webb,S L Wright

Lake Buena Vista, FL, pp.538-543, (2008)

Cited by142EIWOSBibtex

Characterization of stacked die using die-to-wafer integration for high yield and throughput

Katsuyuki Sakuma,Paul S Andry,Cornelia K Tsang,Kuniaki Sueoka,Yukifumi Oyama,Chirag S Patel,Bing Dang,S L Wright,Bucknell C Webb,E Sprogis,R J Polastre,Raymond R Horton

Electronic Components and Technology Conference, pp.18-+, (2008)

Cited by25Bibtex

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