Bongjin Kim

Bongjin Kim (Senior Member, IEEE) received the B.S. and M.S. degrees from the Pohang University of Science and Technology, Pohang, South Korea, in 2004 and 2006, respectively, and the Ph.D. degree in electrical and computer engineering from the University of Minnesota, Minneapolis, MN, USA, in 2014. He was with Rambus, Sunnyvale, CA, USA, where he was a Senior Technical Staff Member and worked on the research of high-speed serial link circuits and microarchitectures. He was a Post-Doctoral Research Fellow with Stanford University, Stanford, CA, USA. From 2006 to 2010, he was with Samsung Electronics, Yongin, South Korea, where he worked on the design of clock generators for high-speed serial links. He also worked with Texas Instruments, Dallas, TX, USA, IBM T. J. Watson Research, Yorktown Heights, NY, USA, and Rambus, Sunnyvale, CA, USA, from 2012 to 2014, as a Research Intern. He was an Assistant Professor with Nanyang Technological University, Singapore, from 2017 to 2020. He is currently an Assistant Professor with the Department of Electrical and Computer Engineering (ECE), University of California at Santa Barbara, Santa Barbara, CA, USA. His research interests include quantum-inspired and brain-inspired computing, memory-centric computing circuits and architectures, domain-specific hardware accelerators, alternative computing, and mixed-signal computing /communication circuit design techniques and methodologies. Dr. Kim received the Doctoral Dissertation Fellowship Award, the International Symposium on Low Power Electronics and Design (ISLPED) International Low Power Design Contest Award, and the Intel/IBM/Catalyst Foundation Award from the Custom Integrated Circuits Conference (CICC). He has been serving as a Technical Program Committee member of the Design Automation Conference (DAC), CICC, and Artificial Intelligence Circuits and Systems (AICAS) and a Guest Editor of the IEEE on Emerging and Selected Topics in Circuits and Systems. His research works appeared at top peer-reviewed integrated circuits and design automation conference proceedings and journals, including IEEE International Solid-State Circuits Conference (ISSCC), Very Large Scale Integration (VLSI) Symposium on Technology and Circuits, IEEE Journal of Solid- State Circuits, IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I), CICC, European Solid-State Circuits Conference (ESSCIRC), Asian Solid-State Circuits Conference (ASSCC), and Design, Automation and Test in Europe Conference (DATE).