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Cornelia Tsang

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Local Measurements of Flow Boiling Heat Transfer on Hot Spots in 3D Compatible Radial Microchannels

Fanghao Yang, Mark D Schultz,Pritish R Parida,Evan G Colgan,R J Polastre,Bing Dang,C Tsang,Michael A Gaynes,John U Knickerbocker, Timothy J Chainer

(2015)

Cited by15Bibtex

Embedded Two-Phase Cooling of Large 3D Compatible Chips With Radial Channels

Mark D Schultz, Fanghao Yang,Evan G Colgan,R J Polastre,Bing Dang,C Tsang,Michael A Gaynes,Pritish R Parida,John U Knickerbocker, Timothy J Chainer

(2015)

Cited by29Bibtex

More Than Moore - Wafer Scale Integration of Dissimilar Materials on a Si Platform

T E Kazior,Jeffery R Laroche, Kelly Ip,T D Kennedy,John U Knickerbocker,C Tsang, Lovelace Soirez

(2015)

Bibtex

Assembly and packaging of non-bumped 3D chip stacks on bumped substrates

Bing Dang,Joana Maria,Qianwen Chen,Jaewoong Nah,Paul S Andry,C Tsang,Keita Sakuma,Christy S Tyberg,R P Robertazzi,M Scheuermann,Michael A Gaynes,John U Knickerbocker

Electronic Components and Technology Conference, pp.1372-1377, (2014)

Cited by4EIWOSBibtex

CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration

Bing Dang,Paul S Andry,C Tsang,Joana Maria,R J Polastre,Robert Trzcinski,Aparna Prabhakar,John U Knickerbocker

Electronic Components and Technology Conference, pp.1393-1398, (2010)

Cited by46EIWOSBibtex

Three-Dimensional Chip Stack With Integrated Decoupling Capacitors and Thru-Si Via Interconnects

Bing Dang, M A Shapiro,Paul S Andry,C Tsang,Edmund J Sprogis,S L Wright,Mario J Interrante, J E Griffith,Vovan Truong, Luc Guerin, R Liptak,Daniel J Berger

IEEE Electron Device Letters, no. 12 (2010): 1461-1463

Cited by11EIWOSBibtex

3D chip stack with integrated decoupling capacitors

Bing Dang,S L Wright,Paul S Andry,Edmund J Sprogis,Supriya Ketkar,C Tsang,R J Polastre,John U Knickerbocker

San Diego, CA, pp.1-5, (2009)

Cited by15EIWOSBibtex

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