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个人简介
Ching-Hsiang Cheng obtained his B.S. degree in Mechanical Engineering from National Taiwan University in 1993, three Master’s degrees in both Electrical and Mechanical Engineering at Cornell University in 1998, and Ph.D. degree in Electrical Engineering at Stanford University in 2005. After completing his postdoctoral research in Stanford, he joined Industrial Technology Research Institute (ITRI) in Taiwan as a researcher and became a project leader. In 2006, he has been appointed as an Assistant Professor and also a Research Engineer in the Research Institute of Innovative Products and Technologies (RIIPT) of The Hong Kong Polytechnic University (PolyU). In 2010, he joined Department of Industrial and Systems Engineering in PolyU as an Assistant Professor. His research interests include large strain and tactile sensors, shear and normal force sensors, capacitive micromachined ultrasonic transducers (CMUT), solar cells, microvalves and micropumps, gas sensors, electrical through-wafer interconnects, nanotechnology, and microelectromechanical systems (MEMS) for healthcare applications.
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论文共 90 篇作者统计合作学者相似作者
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JOURNAL OF ADHESION SCIENCE AND TECHNOLOGYno. 4 (2023): 706-720
JOURNAL OF SOLID STATE ELECTROCHEMISTRYno. 9 (2023): 2509-2521
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IEEE Transactions on Power Electronicsno. 7 (2023): 8379-8393
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Journal of Solid State Electrochemistryno. 9 (2023): 2509-2521
2022 International Conference on Image Processing, Computer Vision and Machine Learning (ICICML)pp.80-89, (2022)
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