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个人简介
Dan Jiao received her Ph.D. degree in Electrical Engineering from the University of Illinois at Urbana-Champaign in October 2001. She then worked at the Technology CAD Division, Intel Corporation, until September 2005, as a Senior CAD Engineer, Staff Engineer (very early promotion), and Senior Staff Engineer (very early promotion). In September 2005, she joined Purdue University as an Assistant Professor with the School of Electrical and Computer Engineering, where she became a tenured Associate Professor in 2009, and a Professor in 2013. She has authored three book chapters and over 260 papers in refereed journals and international conferences. At Intel, she was responsible for a number of original algorithms in high-frequency VLSI CAD such as "Electromagnetic solutions for full-chip Analysis" (US patent No. 7,509,247). Many of her developments have been acknowledged as BKM (Best Known Method) CAD tools across Intel. Her current research interests include computational electromagnetics, modeling and simulation of micro- and nano-scale integrated circuits, high-speed VLSI circuit design and analysis, high-performance VLSI CAD, applied electromagnetics, signal and power integrity, fast and high-capacity numerical methods, scattering and antenna analysis, and bio-electromagnetics.
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论文共 229 篇作者统计合作学者相似作者
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IEEE JOURNAL ON MULTISCALE AND MULTIPHYSICS COMPUTATIONAL TECHNIQUES (2024): 10-19
IEEE Journal on Multiscale and Multiphysics Computational Techniques (2024): 10-19
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IEEE JOURNAL ON MULTISCALE AND MULTIPHYSICS COMPUTATIONAL TECHNIQUES (2023): 11-21
2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI)pp.1203-1204, (2023)
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IEEE Journal on Multiscale and Multiphysics Computational Techniques (2023): 135-146
PHYSICAL REVIEW APPLIEDno. 6 (2023)
2023 International Applied Computational Electromagnetics Society Symposium (ACES)pp.1-2, (2023)
Science advancesno. 4 (2023): 1-2
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