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排名必读论文期刊顶会热点AI 简史溯源树小脉星探人才迁徙塔尖人才国防情报追踪开源工具智慧手语
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论文共 67 篇作者统计合作学者相似作者

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Aluminum-nitride-based modular photonic integrated circuit technology and characterization platform (PIC-TCP)
Franz Tank, Julia Wecker,Chris Stoeckel,Christian Helke, Sebastian Schermer,Alexey Shaporin,Karla Hiller,Danny Reuter
Integrated Optics: Devices, Materials, and Technologies XXVIII (2024)
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Combining nano-scale imprint lithography and reactive ion etching to fabricate high-quality surface relief gratings
Micha Haase, Nils Dittmar, Andrea Kneidinger, Patrick Schuster, Frederik Bachhuber,Christian Helke,Danny Reuter
Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XVII (2024)
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Advancing Fine Pitch (< 5μm) Interconnects through Self-Aligned Die-to-Wafer Hybrid Bonding for Chiplet Integration
Vikas Dubey, Dirk Wünsch, Knut Gottfried, Robert Kinner, Rajat Suroshe, Matthias Küchler, Ronny Stephan, Sebastian Schermer,Christian Helke, Micha Hasse,Danny Reuter, Maik Weimer,
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.469-473, (2023)
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Intra-level mix and match lithography with electron beam lithography and i-line stepper combined with resolution enhancement for structures below the CD-limit
C. Helke, C.H. Canpolat-Schmidt, G. Heldt, S. Schermer, S. Hartmann, A. Voigt,D. Reuter
Micro and Nano Engineering (2023): 100189-100189
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Measuring Ion Energy Distributions by Retarding Field Energy Analyzer and Using Low-Energy Ions for Si-ALE by Cl2
Nils Dittmar,Birk Berger,Marcel Melzer, Matthias Küchler,Christoph Meinecke, Micha Haase,Danny Reuter
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)pp.1-3, (2023)
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Measuring Ion Energy Distributions by Retarding Field Energy Analyzer and Using Low-Energy Ions for Si-ALE by Cl2
Nils Dittmar,Birk Berger,Marcel Melzer,Matthias Kuechler,Christoph Meinecke,Micha Haase,Danny Reuter
2023 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC AND IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE, MAM, IITC/MAM (2023)
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Process and Design Challenges for Hybrid Bonding
Vinay Dubey, Dirk Wünsch, Knut Gottfried,Maik Wiemer,Tobias Fischer, Anke Hanisch, Sebastian Schermer,Christian Helke, M. Hasse,Danny Reuter,Stefan E. Schulz, Sanjoy Ghosal,
ECS transactionsno. 3 (2023): 73-81
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