Edmund J. Sprogis

IBM Systems and Technology Group

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Papers89 papers

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GaN Devices on a 200 mm Si Platform Targeting Heterogeneous Integration

Ko Tao Lee,Can Bayram,Daniel Piedra,Edmund J. Sprogis,Hariklia Deligianni, Balakrishnan Krishnan,George D. Papasouliotis, Ajit Paranjpe, Eyal Aklimi,Kenneth L. Shepard,Tomas Palacios,Devendra K. Sadana

IEEE Electron Device Letters, no. 8 (2017): 1094-1096

EIWOSBibtex

Through silicon via and method of fabricating same

Paul S Andry,Edmund J Sprogis,Cornelia K Tsang

(2014)

Cited by11Bibtex

Through silicon via for use in integrated circuit chips

Paul S Andry,Edmund J Sprogis,Cornelia K Tsang

(2014)

Cited by1Bibtex

Flattened substrate surface for substrate bonding

Edward C Cooney, James S Dunn, Dale W Martin,Charles F Musante, Bethann Rainey, Leathen Shi,Edmund J Sprogis,Cornelia K Tsang

(2014)

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Processor voltage regulation

Huajun Wen, Joshua D Friedrich, Norman K James,Seongwon Kim, John R Ripley,Edmund J Sprogis

(2014)

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Method of making heat sink for integrated circuit devices

Douglas D Coolbaugh, Ebenezer E Eshun,Terence B Hook,Robert M Rassel,Edmund J Sprogis,Anthony K Stamper,William J Murphy

(2014)

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COIL INDUCTOR FOR ON-CHIP OR ON-CHIP STACK

Michael J Shapiro, Gary D Carpenter, Alan J Drake, Rachel Gordin,Edmund J Sprogis

(2013)

Cited by4Bibtex

RELEASABLE BURIED LAYER FOR 3-D FABRICATION AND METHODS OF MANUFACTURING

Timothy H Daubenspeck,Steven E Molis, G Osborne, Wolfgang Sauter,Edmund J Sprogis

(2013)

Bibtex

Integrated decoupling capacitor employing conductive through-substrate vias

Tae Hong Kim,Edmund J Sprogis, Michael F Mcallister,Michael J Shapiro

(2013)

Cited by13Bibtex

DEEP TRENCH DECOUPLING CAPACITOR AND METHODS OF FORMING

James S Nakos,Edmund J Sprogis, Anthony K Stamper

(2013)

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Deep trench decoupling capacitor

James S Nakos,Edmund J Sprogis, Anthony K Stamper

(2013)

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CMOS structure and method of manufacture

Paul S Andry,Edmund J Sprogis,Cornelia K Tsang

(2013)

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Stacked Through-Silicon Via (TSV) Transformer Structure

Gary D Carpenter, Alan J Drake, Rachel Gordin,Michael J Shapiro,Edmund J Sprogis

(2013)

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INTEGRATED CIRCUIT AND DESIGN STRUCTURE HAVING REDUCED THROUGH SILICON VIA-INDUCED STRESS

Jeffrey P Bonn, Brent A Goplen, Brian L Kinsman,Robert M Rassel,Edmund J Sprogis, Daniel S Vanslette

(2012)

Cited by1Bibtex

High-yield method of exposing and contacting through-silicon vias

Paul S Andry, John M Cotte, M Lofaro,Edmund J Sprogis, J A Tornello,Cornelia K Tsang

(2012)

Cited by6Bibtex

METAL WIRING STRUCTURES FOR UNIFORM CURRENT DENSITY IN C4 BALLS

Timothy H Daubenspeck, Wolfgang Sauter, Timothy D Sullivan,S L Wright,Edmund J Sprogis

(2012)

Cited by6Bibtex

Electrostatic chucking of an insulator handle substrate

Paul S Andry, Edward C Cooney,Edmund J Sprogis, Anthony K Stamper,Cornelia K Tsang

(2012)

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Through wafer vias with dishing correction methods

Peter J Lindgren,Edmund J Sprogis, Anthony K Stamper

(2012)

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Process for wet singulation using a dicing singulation structure

Paul S Andry,Timothy H Daubenspeck, Jeffrey P Gambino,Edmund J Sprogis,Cornelia K Tsang

(2012)

Cited by2Bibtex

ARRANGING THROUGH SILICON VIAS IN IC LAYOUT

Donald R Dean, Peter J Lindgren, Glen L Miles,Edmund J Sprogis, Anthony K Stamper

(2011)

Cited by3Bibtex

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Edmund J. SprogisBinding

Papers89 papers

Edmund J. Sprogis