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个人简介
Fa Xing Che (Member, IEEE) received the Ph.D. degree in engineering mechanics from Nanyang Technological University, Singapore, in 2006.,From 2006 to 2009, he was a Senior Engineer with the United Test and Assembly Centre, Singapore, and STMicroelectronics, Singapore. From 2009 to 2011, he was a Scientist with the Institute of Microelectronics (IME), Singapore. From 2011 to 2013, he was a Staff Engineer with Infineon Technologies Asia Pacific, Singapore. He is currently a Scientist with IME. He has authored or coauthored more than 145 technical papers in refereed journals and conference proceedings. His current research interests include design for reliability in advanced packaging, through-silicon via (TSV) technology, fan-out wafer-level/panel-level packaging technology (FO-WLP/PLP), mechanical and thermomechanical finite-element analysis, SMART codesign modeling and simulation, and characterization of microelectronic packaging materials.,Dr. Che was a recipient of the Best Poster Paper Award from the IEEE Electronic Packaging Technology Conference (EPTC) in 2013, the Best Poster Paper Award from the Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems in 2006 (ITherm2006), the Best Paper Award from the International Conference on Electronic Packaging Technology in 2006 (ICEPT2006), and the Outstanding Student Paper Award from the IEEE EPTC in 2003. He serves as a peer reviewer for more than 35 international scientific journals.(Based on document published on 3 November 2020).
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The 8th International Symposium on Test Automation & Instrumentation (ISTAI 2020) (2020): 197-205
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