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个人简介
My research interests are in the multidisciplinary area of microelectromechanical systems (MEMS), and focus primarily on design, fabrication, and control aspects of microsensor- and microactuator-based systems. In MEMS, micron- to millimeter-size systems with sophisticated abilities to interact with their environment are manufactured through the use of VLSI-based photolithographic batch fabrication methods. Benefits of this approach include much lower manufacturing cost, greater miniaturization, greater integration, and in many cases higher performance than can be achieved with conventional methods used to build systems requiring sensors and actuators.
The diverse set of research projects in my group links to a long-term trend toward low-cost intelligent systems that benefit from embedded MEMS, often merged with other emerging technologies, for example, nanomaterials, 3D printing and soft robotics. Active projects include MEMS system modeling and design methodologies, accelerometers and gyroscopes for motion sensing, an electrothermal microcooler system, ultra-compliant neural probes, piezoelectric energy scavenging for implantable pressure sensors, nonlinear parametric microresonators, and self-healing RF microresonator oscillators and filters. Challenges include system design, process integration, and physical modeling including environmental effects.
Two legacy foundational themes in my group are 1) monolithic integration of MEMS in conventional foundry CMOS processes and 2) a system-level design methodology and corresponding simulation tools. Continuing research along these themes involves emergent behavior of large and/or complex systems of microsensors and actuators, and a broadening of manufacturing capabilities for integrated MEMS.
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IEEE JOURNAL OF SOLID-STATE CIRCUITSno. 2 (2024): 502-515
IEEE J. Solid State Circuitsno. 2 (2024): 502-515
IEEE Journal of Solid-State Circuitsno. 99 (2023): 1-14
IEEE Journal of Solid-state Circuitspp.1-14, (2023)
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Advanced science (Weinheim, Baden-Wurttemberg, Germany)no. 20 (2023)
2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)pp.353-356, (2022)
ADVANCED MATERIALS TECHNOLOGIESno. 12 (2022): 2200396-2200396
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