基本信息
浏览量:110
职业迁徙
个人简介
working on energy-efficient data converter, power/signal integrity, and 3-D integration technologies, where he is currently the Program Manager in 3-D program addressing system scaling using advanced 3-D through-silicon via (TSV) and packaging fan-out wafer-level packaging (FO-WLP) technology for high-performance, mobile, and the Internet of Things applications. His research interests include characterization, modeling, system exploration, and design enablement of 3-D integration technologies.
研究兴趣
论文共 342 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1072-1077, (2024)
Fluidsno. 3 (2024): 69-69
Melina Lofrano,Herman Oprins,Vladimir Cherman, Lisbeth Witters,Anne Jourdain,Geert Van der Plas,Eric Beyne
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1036-1043, (2024)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1064-1071, (2024)
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 7 (2024): 1180-1188
Microelectronic Engineering (2023): 111947-111947
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-10, (2023)
Mohamed Naeim,Hanqi Yang, Pinhong Chen, Rong Bao, Antione Dekeyser,Giuliano Sisto,Moritz Brunion,Rongmei Chen,Geert Van der Plas, Erik Beyne,Dragomir Milojevic
2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC (2023)
引用0浏览0引用
0
0
Mohamed Naeim,Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser,Giuliano Sisto,Moritz Brunion,Rongmei Chen,Geert Van der Plas,Eric Beyne,Dragomir Milojevic
2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC (2023)
加载更多
作者统计
#Papers: 348
#Citation: 8724
H-Index: 47
G-Index: 79
Sociability: 7
Diversity: 3
Activity: 18
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn