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Gan, H.

IBM Syst. & Technol. Group, Hopewell Junction, NY|c|

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System-on-package (SOP) technology, characterization and applications

John U Knickerbocker,Paul S Andry,L P Buchwalter,Evan G Colgan,John M Cotte,Haitao Gan,R R Horton,Sri M Srijayantha,J H Magerlein,Dennis G Manzer,G Mcvicker,Chirag S Patel

San Diego, CA, pp.415-+, (2006)

Cited by17EIWOSBibtex

Pb-free microjoints (50 /spl mu/m pitch) for the next generation microsystems: the fabrication, assembly and characterization

Haitao Gan,S L Wright,R J Polastre,L P Buchwalter,Raymond R Horton,Paul S Andry,Chirag S Patel, Ching Tsang,John U Knickerbocker,Edmund J Sprogis, A Pavlova,S K Kang

San Diego, CA, pp.1210-+, (2006)

Cited by39EIWOSBibtex

Characterization of micro-bump C4 interconnects for Si-carrier SOP applications

S L Wright,R J Polastre,Haitao Gan,L P Buchwalter,Raymond R Horton,Paul S Andry,Edmund J Sprogis,Chirag Patel, Ching Tsang,John U Knickerbocker, J R Lloyd,Ajay Kumar Sharma

Electronic Components and Technology Conference, pp.633-+, (2006)

Cited by58Bibtex

Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology

John U. Knickerbocker,Chirag S. Patel,Paul S. Andry,Cornelia K. Tsang,L. Paivikki Buchwalter,Edmund J. Sprogis,Hua Gan,Raymond R. Horton,Robert J. Polastre,Steven L. Wright,Christian D. Schuster,Christian W. Baks

IEEE Custom Integrated Circuits Conference, pp.659-662, (2005)

Cited by28EIWOSBibtex

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