Hao Gao

Hao Gao (Member, IEEE) received the B.Eng. degree from Southeast University, Nanjing, China, in 2006, the M.Sc. degree in electrical engineering from the ELCA-Group, Delft University of Technology, Delft, The Netherlands, in 2008, and the Ph.D. degree from the Eindhoven University of Technology, Eindhoven, The Netherlands, in 2015. In 2007, he was with Catena Microelectronics (now NXP), Delft. In 2008, he was with Philips Research, Eindhoven. In 2012, he was a European Marie Curie Researcher with the Catena Wireless Electronics Group, NXP Semiconductors, Stockholm, Sweden. In 2014, he was ranked as a Staff Engineer at MediaTek, U.K. In 2014, he joined the ELCA-Group, Delft University of Technology, as a Research Scientist. Since 2016, he has been holding a faculty position with the Electrical Engineering Department, Eindhoven University of Technology, where he is currently a member of the University Central Ethics Committee Board and the International Student Selection Committee. He has been also a Principal Scientist at Silicon Austria Labs, Linz, Austria, since 2019, with a joint professorship. He did a consultant for industries for years, including NXP and Infineon. Dr. Gao was a recipient of the Philips Semiconductor Scholarship, Delft, in 2006. He was a recipient of the IEEE MTT-S International Microwave Symposium (IMS) and IEEE International Symposium on Circuits and Systems (ISCAS) grants. He was a recipient and a co-recipient of several best paper rewards, including IEEE Microwaves and Theory and Technology Society (MTT-S) Radio Wireless Week Award, the International Conference on Information and Communications Signal Processing Award, the IEEE MTT-S International Wireless Symposium Award, and the IEEE IMS Student Design Competition Award. He was also a co-recipient of the 2015 IEEE International Conference on Solid-State Circuits (ISSCC) Distinguished Technical Paper Award, the CATRENE Innovation Award with the EAST Project, and others. He has served as the TPC Co-Chair of IEEE International Symposium on Radio-Frequency Integration Technology (RFIT) 2019, IEEE International Wireless Symposium (IWS) 2023, the Visa-Chair of EuMW 2020, and is now a TPC Member of ISSCC SRP, IEEE Asian Solid-State Circuits Conference (A-SSCC), IEEE Symposium on Radio Frequency Integrated Circuits (RFIC), and others. He is also an Editorial Board Member of Wireless Power Transfer journal (Cambridge).