Hui Wu

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Hui Wu (Student Member, IEEE) received the B.Eng. degree in microelectronics science and engineering from Fudan University, Shanghai, China, in 2021. He is currently working toward the Ph.D. degree with Westlake University, Hangzhou, China. From 2018 to 2021, he received outstanding undergraduate scholarships from Fudan University. In 2021, he joined the Center of Excellence in Biomedical Research on Advanced Integrated-on-chips Neurotechnologies (CenBRAIN Neurotech), Westlake University. His research interests include high-performance readout circuits and low-power system-on-chip for biomedical applications, and brain-machine interfaces.

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