Working on fs laser TOF-based, ultrafast motion capturing of MEMS devices
Awards: Outstanding Paper Award from OSK Summer Meeting 2019, Jul 2019
Selected Patents:
- "Thickness prediction network learning method, semiconductor device manufacturing method, and semiconductor material deposition equipment" with S. Ryu, S. Cho, Y. Yang, C. Lee and J. Kim, Korean Patent Application 10-2018-0160344; US Patent Application 16678755.
- "Apparatus and method for inspecting multi-layer structure, method for fabricating semiconductor device comprising the method" with S. Ryu, J. Kim, Y. Yang and C. Jun, Korean Patent Application 10-2017-0148715; Chinese Patent Application 201810982065.9; US Patent Application 16135640