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个人简介
James A. Burns (M'98) received the B.S. degree from Carnegie Institute of Technology, Pittsburgh, PA, in 1960 and the Ph.D. degree from University of Vermont, Burlington, in 1975, both in physics.
He worked in semiconductor and magnetic film device design and processing at IBM and charge-coupled device (CCD) design while at Honeywell. Since 1975, he has been a Staff Member at Massachusetts Institute of Technology (MIT)'s Lincoln Laboratory. He developed the laboratory's deep submicrometer fully depleted SOI (FDSOI) process, incorporated that SOI technology into a three-dimensional (3-D) integrated circuit technology and led the effort to design and fabricate Defense Advanced Research Projects Agency (DARPA)'s first 3-D-multiproject chip.
Dr. Burns won the Best Paper Award at the 2001 IEEE International SOI Conference. He served on the executive committee of the IEEE International SOI Conference as general chair of the 2005 conference. He is a member of the American Physical Society and Tau Beta Pi.
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论文共 20 篇作者统计合作学者相似作者
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Handbook of 3D Integration (2008)
Brian F Aull,J A Burns,C K Chen,Bradley J Felton, Helen M Hanson,Craig L Keast,J M Knecht,A H Loomis,Matthew J Renzi,A Soares,Vyshnavi Suntharalingam,Keith Warner, Daniel C Wolfson,D R W Yost,Darrin J Young
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作者统计
#Papers: 20
#Citation: 748
H-Index: 10
G-Index: 10
Sociability: 4
Diversity: 2
Activity: 0
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