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JENQ-GONG DUH received B.S. in Nuclear Engineering from National Tsing Hua University, Taiwan in 1974, and Ph.D in Material Engineering from Purdue University, U.S.A. in 1983. He has joined the Department of Material Science and Engineering, NTHU since 1983, and now is the Chair Professor. His research interests involve fabrication of cathode and anode material for Li-battery, solder joint reliability in microelectronic package, hard coating and surface modification, as well as the characterization of material by electron microscopy. He has received the outstanding research award from National Science Council, the outstanding teaching award from NTHU. He is also the recipient of numerous social service awards from Rotary International. Since Jan 2011, he also acts as the coordinator for material program in National Science Council.
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MATERIALS CHARACTERIZATION (2024): 113490-113490
MATERIALS CHEMISTRY AND PHYSICS (2023): 127392-127392
VACUUM (2023): 112531-112531
Materials Chemistry and Physics (2023): 127149-127149
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.484-487, (2023)
IEEE Transactions on Plasma Scienceno. 2 (2023): 437-443
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY Ano. 4 (2023)
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