Jeongtak Moon

MK Electron Co., Ltd, 316-2 Geumeoh-ri, Pogok-eup, Cheoin-gu, Yongin-si, Kyeonggi-do, 449-812 Republic of Korea

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Papers38 papers

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Comparison of Metal Distribution and Bonding Characteristics according to FAB Formation Conditions

SangYeob Kim, SungMin Jeon, ByungHoon Jung, SeungHyoun Kim,JeongTak Moon

electronics packaging technology conference, (2019)

Bibtex

New Alternative Metal Coated Silver Bonding Wire for Gas Free Bonding & High Reliability Performance

SangYeob Kim, SungMin Jeon, ChongMin Park, BuyngHoon Jung, SeungHyoun Kim,JeongTak Moon

electronics packaging technology conference, (2018)

Bibtex

Effects of Pd distribution at free air ball in Pd coated Cu wire

Byung Hoon Jung, Byung Kwan Yu, Seung Hyoun Kim,Jeong Tak Moon, Sang Jeen Hong

electronics packaging technology conference, (2017)

Bibtex

Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

Won Sik Hong,Chulmin Oh, Mi-Song Kim,Young Woo Lee, Hui Joong Kim, Sung Jae Hong,Jeong Tak Moon

Journal of Electronic Materials, no. 12 (2016): 6150-6162

Bibtex

Breakup behavior of a molten metal jet

Oh Ys Oh Yongsuk,Choi Dy Choi Dong Yun, Son Jy Son Jae Yeol, Kim B Kim Boyoung, Kang Hw Kang Hyunwook, Chang Cb Chang Cheongbong,Moon Jt Moon Jeongtak, Sung Hj Sung Hyungjin

International Journal of Heat and Fluid Flow, (2014): 27-37

Cited by4Bibtex

P-129 Prognostic implication of Revised International Prognostic Scoring System (IPSS-R) for the patients treated with hypomethylating agents

Jeongtak Moon,Sang Kyun Sohn,S N Lim,Sang Ho Bae, Hee Jung Kim, Y K Kim

Leukemia Research, (2013)

Bibtex

Investigation of interfacial phenomena of alloyed Au wire bonding

H J Kim,Minseok Song,Kyungwook Paik,Jeongtak Moon,Junyeob Song

Electronics Packaging Technology Conference, pp.479-482, (2013)

EIWOSBibtex

Explaining Nondestructive Bond Stress Data From High-Temperature Testing of Au-Al Wire Bonds

M Mccracken, Yusuke Koda, H J Kim,Michael Mayer,John Persic, J S Hwang,Jeongtak Moon

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 12 (2013): 2029-2036

Cited by13EIWOSBibtex

An All-Solid-State Li-Ion Battery with a Pre-Lithiated Si-Ti-Ni Alloy Anode

Thomas A Yersak,Seoungbum Son,Jong Soo Cho,Soonsung Suh,Youngugk Kim,Jeongtak Moon,Kyu Hwan Oh,Sehee Lee

Journal of The Electrochemical Society, (2013)

Cited by20Bibtex

Publisher's Note: An All-Solid-State Li-Ion Battery with a Pre-Lithiated Si-Ti-Ni Alloy Anode [J. Electrochem. Soc., 160, A1497 (2013)]

Thomas A Yersak,Seoungbum Son,Jong Soo Cho,Soonsung Suh,Youngugk Kim,Jeongtak Moon,Kyu Hwan Oh,Sehee Lee

Journal of The Electrochemical Society, (2013)

Bibtex

Embedded Si Nano Wire Anode for Lithium-Ion Secondary Cells

Jongsoo Cho,Jeongtak Moon,Seoungbum Son, Sunghwan Moon, Chungyoo Lee, Yoonchang Kim, Sehee Lee, Kyuhwan Oh

(2012)

Bibtex

A Highly Reversible Nano‐Si Anode Enabled by Mechanical Confinement in an Electrochemically Activated LixTi4Ni4Si7 Matrix

Seoungbum Son,Seul Cham Kim,Chan Soon Kang, Thomas A Yersak,Yoonchang Kim, Chungyoo Lee, Sunghwan Moon,Jong Soo Cho,Jeongtak Moon,Kyu Hwan Oh,Sehee Lee

ADVANCED ENERGY MATERIALS, no. 10 (2012): 1226.0-1231.0

Cited by31Bibtex

Pd effect on reliability of Ag bonding wires in microelectronic devices in high-humidity environments

Jongsoo Cho,Kyungah Yoo,Jeongtak Moon,Seoungbum Son,Sehee Lee,Kyu Hwan Oh

Metals and Materials International, no. 5 (2012): 881-885

Cited by16Bibtex

Relationship between microstructure homogeneity and bonding stability of ultrafine gold wire

Seoung-Bum Son,Hyunchul Roh,Suk Hoon Kang,Hee-Suk Chung,Do Hyun Kim,Yong Seok Choi,Jong Soo Cho,Jeong-Tak Moon,Kyu Hwan Oh

Gold Bulletin, no. 4 (2011): 231-237

Cited by12Bibtex

Fracture behavior of Cu-cored solder joints

Hyelim Choi,Hyoungjoo Lee,Dongjun Shin,Jeongtak Moon,Heeman Choe,Yunsung Kim

Journal of Materials Science, (2011)

Cited by8Bibtex

Free-air ball formation and deformability with Pd coated Cu wire

Ali Reza Rezvani,M Mayer, Aamir Hassan Shah,Neng Zhou,S J Hong,J T Moon

Electronic Components and Technology Conference, pp.1516-1522, (2011)

Cited by12EIWOSBibtex

A numerical approach on the inclusion effects in ultrafine gold wire drawing process

Seoungbum Son,Y K Lee,Suk Hoon Kang,Heesuk Chung,Jong Soo Cho,Jeongtak Moon,Kyu Hwan Oh

Engineering Failure Analysis, no. 5 (2011): 1272-1278

Cited by3Bibtex

Effect of fine solder ball diameters on intermetallic growth of Sn-Ag-Cu solder at Cu and Ni pad finish interfaces during thermal aging

Yongsung Park,Jeongtak Moon,Youngwoo Lee, Jaehong Lee,Kyungwook Paik

(2011)

Cited by3Bibtex

Microstructure Study of Electrochemically Driven LixSi

Seoungbum Son,James E Trevey,Hyunchul Roh,Sunghwan Kim,Keebum Kim,Jong Soo Cho,Jeongtak Moon,C Deluca,Kurt Maute,Martin L Dunn,Heung Nam Han,Kyu Hwan Oh

ADVANCED ENERGY MATERIALS, no. 6 (2011): 1199.0-1204.0

Cited by48Bibtex

Fracture behavior of Cu-cored solder joints

Yunsung Kim,Hyelim Choi,Hyoungjoo Lee,Dongjun Shin,Jeongtak Moon,Heeman Choe

Journal of Materials Science, no. 21 (2011): 1-7

Cited by12Bibtex

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Jeongtak MoonBinding

Papers38 papers

Jeongtak Moon