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浏览量:442
职业迁徙
个人简介
2014 IEEE WPTC International Conference Chair
2015 IEEE EDAPS International Conference Chair
2016 APEMC International Conference Chair
2001 ~IEEE Transactions on Electromagnetic Compatibility Associated Editor
2016 ~ IEEE Fellow
2015 IEEE EDAPS International Conference Chair
2016 APEMC International Conference Chair
2001 ~IEEE Transactions on Electromagnetic Compatibility Associated Editor
2016 ~ IEEE Fellow
研究兴趣
论文共 670 篇作者统计合作学者相似作者
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITYno. 1 (2024): 256-269
IEEE Transactions on Electromagnetic Compatibilityno. 99 (2024): 1-11
2023 20TH INTERNATIONAL SOC DESIGN CONFERENCE, ISOCCpp.213-214, (2023)
2023 IEEE WIRELESS POWER TECHNOLOGY CONFERENCE AND EXPO, WPTCEpp.1-5, (2023)
2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2023)
2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPSpp.1-3, (2023)
2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPSpp.1-3, (2023)
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITYno. 6 (2023): 1674-1683
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Seongguk Kim,Keeyoung Son, Jiwon Yoon,Taein Shin,Keunwoo Kim,Boogyo Sim, Joonsang Park, Seonguk Cho,Jihun Kim,Haeyeon Kim,Joungho Kim,Hyunwook Park
2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)pp.1-3, (2023)
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