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Bio
Junghyun Lee received the B.S. degree in automotive engineering from Hanyang University, Seoul, South Korea, in 2022. He is currently pursuing the M.S. degree in electrical engineering with Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea.
His current research interests include machine learning based eye diagram estimation in the context of design for 2.5-D/3-D ICs, with a particular emphasis on signal integrity (SI), and power integrity (PI).
Research Interests
Papers共 17 篇Author StatisticsCo-AuthorSimilar Experts
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Jungmin Ahn,Seonguk Choi,Taein Shin,Junghyun Lee,Jiwon Yoon,Keunwoo Kim,Keeyoung Son, Haeseok Suh,Taesoo Kim, Hyunah Park, Hyunjun An,Jinwook Song,Joungho Kim
2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2024)
Haeseok Suh,Jiwon Yoon,Keeyoung Son,Seonguk Choi,Keunwoo Kim,Junghyun Lee,Taein Shin, Hyunjun An,Taesoo Kim, Jungmin Ahn, Hyunah Park,Hyunsik Kim,Taeil Bae,Haekang Jung,Joungho Kim
2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2024)
2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2024)
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 4 (2024): 681-692
2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2024)
Junghyun Lee,Keeyoung Son, Junho Park,Joonsang Park,Keunwoo Kim, Hyunjun An,Seonguk Choi,Jihun Kim, Hyunah Park, Sumi Choi, Sanghyuk Son,Joungho Kim
2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2024)
Hyunah Park,Seonguk Choi,Haeyeon Kim,Taein Shin,Keeyoung Son,Jiwon Yoon,Junghyun Lee, Haeseok Suh,Taesoo Kim, Jungmin Ahn, Hyunjun An,Joungho Kim
2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2024)
Taein Shin,Seonguk Choi, Jungmin Ahn,Junghyun Lee,Keunwoo Kim, Haeseok Suh, Hyunah Park,Haeyeon Kim, Hyunjun An,Jinwook Song,Joungho Kim
2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2024)
Hyunjun An,Junghyun Lee,Keeyoung Son,Seonguk Choi,Taein Shin,Keunwoo Kim,Jiwon Yoon,Taesoo Kim, Jungmin Ahn, Hyunah Park, Haeseok Suh,Joungho Kim
2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2024)
2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (2023)
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Author Statistics
#Papers: 17
#Citation: 7
H-Index: 1
G-Index: 2
Sociability: 3
Diversity: 0
Activity: 0
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