Kevin R. Bagnall

ACS applied materials & interfaces, no. 6 (2020): 7232-7238

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 8 (2019): 1663-1663

Nano letters, no. 7 (2019): 4745-4751

ACS applied materials & interfaces, no. 23.0 (2019): 26525.0-26533.0

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 8 (2019): 1663-1663

Applied Physics Letters, no. 16 (2018): 163701

Microsystems & Nanoengineering, no. 1 (2018): 1

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 4 (2018): 606-620

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 2 (2018): 269-278

The Review of scientific instruments, no. 11 (2017): 113111

IEEE Transactions on Electron Devices, no. 5 (2017): 2121-2128

intersociety conference on thermal and thermomechanical phenomena in electronic systems, pp.505-513, (2017)

conference on lasers and electro optics, (2016)

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 7 (2016): 1056-1065

The Review of scientific instruments, no. 6 (2016): 061501

intersociety conference on thermal and thermomechanical phenomena in electronic systems, pp.1551-1557, (2016)

intersociety conference on thermal and thermomechanical phenomena in electronic systems, pp.23-29, (2016)

Journal of Applied Physics, no. 15 (2016): 155104

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 5 (2014): 817-830

Thermal and Thermomechanical Phenomena in Electronic Systems, pp.947-958, (2014)