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Buchwalter, L.P.

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Pb-free microjoints (50 /spl mu/m pitch) for the next generation microsystems: the fabrication, assembly and characterization

Haitao Gan,S L Wright,R J Polastre,L P Buchwalter,Raymond R Horton,Paul S Andry,Chirag S Patel, Ching Tsang,John U Knickerbocker,Edmund J Sprogis, A Pavlova,S K Kang

San Diego, CA, pp.1210-+, (2006)

Cited by39EIWOSBibtex

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

Knickerbocker, J.U.,Andry, P.S.,Buchwalter, L.P.,Deutsch, A.

IBM Journal of Research and Development, no. 4 (2005): 725-753

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