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排名必读论文期刊顶会热点AI 简史溯源树小脉星探人才迁徙塔尖人才国防情报追踪开源工具智慧手语
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论文共 52 篇作者统计合作学者相似作者

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Investigation of the Processing Behavior and Stability of Different Glass Frit Materials
Roy Knechtel, Micaela Wenig, Stefan Svoboda, Martin Seyring, Manuela Göbelt, Uwe Schwarz,Tobias Seifert,Frank Roscher,Maik Wiemer
ECS transactionsno. 3 (2023): 229-246
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Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration
Tobias Wernicke,Bernhard Rebhan, Vesa Vuorinen, Mervi Paulasto‐Kröckel, Vinay Dubey, Kevin Diex, Dirk Wünsch,Mario Baum,Maik Wiemer, Shuji Tanaka, Joerg Froemel, Knut E. Aasmundtveit,
ECS transactionsno. 3 (2023): 247-263
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Reactive chip level bonding based on CuO/Al reactive multilayer systems
Klaus Vogel, Ralph Schachler,Frank Roscher,Maik Wiemer,Harald Kuhn
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)pp.1-6, (2021)
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Electrochemical Deposition of Reactive Material Systems for Assembly and Packaging Applications
Silvia Hertel, Wiebke Schulte, Mathias Weiser, Mike Becker,Maik Wiemer,Thomas Otto
Micro-Nano-Integration; 7th GMM-Workshoppp.1-6, (2018)
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Evaluation of Ag-sinter and CuSn-TLP Based Joining Technologies on Lead Frame
Alexander Otto,Tim Schroeder,Rainer Dudek,Wei-Shan Wang,Mario Baum,Maik Wiemer, Ralf Doering, Jyothi Jennifer Kurian,Kei Murayama,Kiyoshi Oi,Tetsuya Koyama,Sven Rzepka
PCIM Europe 2018; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Managementpp.1-8, (2018)
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Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor
Mario Baum,Dirk Wuensch,Karla Hiller,Roman Forke,Tim Schroeder, Sebastian Weidlich, Susann Hahn,Danny Reuter,Maik Wiemer, Jens Weidenmueller, Oezgue Dogan,Michael Goertz,
2017 PAN PACIFIC MICROELECTRONICS SYMPOSIUM (PAN PACIFIC)pp.1-8, (2017)
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