Paragkumar a Thadesar

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA|c|

Show Academic Trajectory

Ego Network

D-Core

Research Interests

Author Statistics

Experience

Education

Bio

None

Papers19 papers

Sort

By YearBy Citation

Experimental Stress Characterization and Numerical Simulation for Copper Pumping Analysis of Through-Silicon Vias

Xi Liu,Paragkumar A. Thadesar,Christine Taylor,Martin Kunz,Nobumichi Tamura,Muhannad S. Bakir,Suresh K. Sitaraman

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 7 (2016): 993-999

EIWOSBibtex

Through-Silicon Vias: Drivers, Performance, and Innovations

Paragkumar A. Thadesar,Xiaoxiong Gu,Ramakanth Alapati,Muhannad S. Bakir

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 7 (2016): 1007-1017

EIWOSBibtex

Fabrication and Characterization of Polymer-Enhanced TSVs, Inductors, and Antennas for Mixed-Signal Silicon Interposer Platforms

Paragkumar A. Thadesar,Muhannad S. Bakir

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 3 (2016): 455-463

EIWOSBibtex

Low-Loss Air-Isolated Through-Silicon Vias for Silicon Interposers

Hanju Oh,Paragkumar A. Thadesar,Gary S. May,Muhannad S. Bakir

IEEE Microwave and Wireless Components Letters, no. 3 (2016): 168-170

EIWOSBibtex

A microfabricated electronic microplate platform for low-cost repeatable biosensing applications

Muneeb Zia,Taiyun Chi,Chaoqi Zhang,Paragkumar A. Thadesar,Tracy A. Hookway, Joe L. Gonzalez,Todd C. McDevitt,Hua Wang,Muhannad S. Bakir

international electron devices meeting, (2015)

Bibtex

Fabrication and characterization of mixed-signal polymer-enhanced silicon interposer featuring photodefined coax TSVs and high-Q inductors

Paragkumar A Thadesar,Muhannad S Bakir

Electronic Components and Technology Conference, pp.281-286, (2015)

Cited by3EIWOSBibtex

Embedded cooling technologies for densely integrated electronic systems

Thomas E. Sarvey,Yang Zhang, Li Zheng,Paragkumar Thadesar, Ravi Gutala,Colman Cheung,Arifur Rahman,Muhannad S. Bakir

IEEE Custom Integrated Circuits Conference, (2015)

Cited by21EIBibtex

Fabrication of and cell growth on ‘silicon membranes’ with high density TSVs for bio-sensing applications

Muneeb Zia,Chaoqi Zhang,Paragkumar A Thadesar,Tracy A Hookway,Taiyun Chi, Joe Gonzalez,Todd C Mcdevitt,Hua Wang,Muhannad S Bakir

2015 IEEE BIOMEDICAL CIRCUITS AND SYSTEMS CONFERENCE (BIOCAS), pp.572-575, (2015)

EIBibtex

Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects

Chaoqi Zhang,Paragkumar Thadesar,Muneeb Zia,Thomas E. Sarvey,Muhannad S. Bakir

3DIC, (2014)

EIBibtex

In-situ microscale through-silicon via strain measurements by synchrotron x-ray microdiffraction exploring the physics behind data interpretation

Xi Liu,Paragkumar A Thadesar,Christine Taylor,Hanju Oh,Martin Kunz,Nobumichi Tamura,Muhannad S Bakir,Suresh K Sitaraman

Applied Physics Letters, (2014)

Cited by15Bibtex

Low-loss silicon interposer for three-dimensional system integration with embedded microfluidic cooling

Thadesar, P.A.,Li Zheng,Bakir, M.S.

VLSI Technology, pp.1-2, (2014)

Cited by1EIWOSBibtex

Thermomechanical strain measurements by synchrotron x-ray diffraction and data interpretation for through-silicon vias

Xi Liu,Paragkumar A Thadesar,Christine Taylor,Martin Kunz,Nobumichi Tamura,Muhannad S Bakir,Suresh K Sitaraman

Applied Physics Letters, (2013)

Cited by20Bibtex

Novel photodefined polymer-embedded vias for silicon interposers

Paragkumar A Thadesar,Muhannad S Bakir

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, no. 3 (2013)

Cited by2Bibtex

Novel through-silicon via technologies for 3D system integration

Thadesar, P.A.,Dembla, A.,Brown, D.,Bakir, M.S.

Interconnect Technology Conference, pp.1-3, (2013)

Cited by2EIWOSBibtex

Endpoint detection using optical emission spectroscopy in TSV fabrication

Ja Myung Gu,Paragkumar A Thadesar,Ashish Dembla,Sang Jeen Hong,Muhannad S Bakir,Gary S May

Interconnect Technology Conference, pp.1-3, (2013)

EIWOSBibtex

Fabrication and characterization of novel photodefined polymer-enhanced through-silicon vias for silicon interposers

Thadesar, P.A.,Bakir, M.S.

Electronic Components and Technology Conference, pp.1970-1974, (2013)

EIWOSBibtex

Novel Photo-Defined Polymer-Enhanced Through-Silicon Vias for Silicon Interposers

Thadesar, P.A.,Bakir, M.S.

Components, Packaging and Manufacturing Technology, IEEE Transactions, no. 7 (2013): 1130-1137

Cited by8EIWOSBibtex

Dimension and liner dependent thermomechanical strain characterization of through-silicon vias using synchrotron x-ray diffraction

Xi Liu,Paragkumar A Thadesar,Christine Taylor,Martin Kunz,Nobumichi Tamura,Muhannad S Bakir,Suresh K Sitaraman

Journal of Applied Physics, (2013)

Cited by19Bibtex

Electrical, optical and fluidic through-silicon vias for silicon interposer applications

Parekh, M.S.,Thadesar, P.A.,Bakir, M.S.

Electronic Components and Technology Conference, pp.1992-1998, (2011)

Cited by35EIWOSBibtex

View All

Base Info Papers Patents Projects

Paragkumar a ThadesarBinding

Papers19 papers

Paragkumar a Thadesar