基本信息
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Career Trajectory
Bio
Raik Hoffmann received the Diploma degree in electrical engineering from the University of Applied Sciences, Zwickau, Germany, in 2003.
He joined the Department of Device and Integration with the Fraunhofer Institut für Photonische Microsysteme-Center Nanoelectronic Technologies, Dresden, Germany, in 2008, where he is currently involved in the development and characterization of advanced semiconductor devices.
Research Interests
Papers共 46 篇Author StatisticsCo-AuthorSimilar Experts
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Daniel Hessler,Ricardo Olivo, Tim Baldauf,Konrad Seidel,Raik Hoffmann, Chaiwon Woo,Maximilian Lederer,Yannick Raffel
Memories - Materials, Devices, Circuits and Systems (2024): 100095
Nature Communicationsno. 1 (2024)
2024 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS 2024 (2024)
2024 INTERNATIONAL VLSI SYMPOSIUM ON TECHNOLOGY, SYSTEMS AND APPLICATIONS, VLSI TSA (2024)
8TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE, EDTM 2024pp.295-297, (2024)
Advanced Intelligent Systems (2024)
Maximilian Lederer,Franz Mueller,Raik Hoffmann,Ricardo Olivo,Yannick Raffel, Shouzhuo Yang,Sourav De, Roman Potjan, Oliver Ostien,Abdelrahman Altawil,Ayse Suenbuel,David Lehninger,Thomas Kaempfe,Konrad Seidel
2024 IEEE INTERNATIONAL MEMORY WORKSHOP, IMW (2024)
2023 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC AND IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE, MAM, IITC/MAM (2023)
IEEE ELECTRON DEVICE LETTERSno. 5 (2023): 757-760
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Author Statistics
#Papers: 47
#Citation: 798
H-Index: 12
G-Index: 28
Sociability: 5
Diversity: 2
Activity: 15
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