Rajarshi Saha

Georgia Institute of Technology(Georgia Institute of Technology,Georgia Inst of Technology),Atlanta,United States

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Papers13 papers

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Fabrication and Electrochemical Performance of Interconnected Silicon Nanowires Synthesized from AlCu Catalyst

Zhongsheng Wen, Johanna K Stark,Rajarshi Saha, Jack Parker,Paul A Kohl

Journal of Physical Chemistry C, (2013)

Cited by4Bibtex

Packaging-compatible wafer level capping of MEMS devices

Rajarshi Saha,Nathan Fritz,Sue Ann Bidstrup-Allen,Paul A. Kohl

Microelectronic Engineering, (2013): 75-84

Cited by4EIBibtex

Design and fabrication of low-loss horizontal and vertical interconnect links using air-clad transmission lines and through silicon vias

Rohit Sharma,Erdal Uzunlar,Vachan Kumar,Rajarshi Saha, Xinyi Yeow,Rizwan Bashirullah,Azad Naeemi,Paul A Kohl

(2012)

Cited by13Bibtex

POLYHEDRAL OLIGOMERIC SILSESQUIOXANE COMPOSITIONS, METHODS OF USING THESE COMPOSITIONS, AND STRUCTURES INCLUDING THESE COMPOSITIONS

Nathan Fritz,Paul A Kohl,Rajarshi Saha

(2012)

Bibtex

Electroless Copper Bonding with Local Suppression for Void-Free Chip-to-Package Connections

Hyochol Koo,Rajarshi Saha,Paul A Kohl

Journal of The Electrochemical Society, (2012)

Cited by2Bibtex

Fabrication and thermo-mechanical characterization of fine pitch all-copper interconnect

Rajarshi Saha,Hyochol Koo,Ping An,Paul A. Kohl

Journal of the Electrochemical Society, no. 9 (2012): D532-D537

WOSSCOPUSBibtex

Chip-Level Packaging of MEMS Devices Using Air-Gap Structures

Nathan Fritz,Rajarshi Saha,Sue Ann Bidstrup Allen,Paul A Kohl

(2011)

Bibtex

Copper Electroless Bonding of Dome-Shaped Pillars for Chip-to-Package Interconnect

Hyochol Koo,Rajarshi Saha,Paul A Kohl

Journal of The Electrochemical Society, (2011)

Cited by3Bibtex

Stabilization of the Thermal Decomposition of Poly(Propylene Carbonate) Through Copper Ion Incorporation and Use in Self-Patterning

Todd J. Spencer,Yu-Chun Chen,Rajarshi Saha,Paul A. Kohl

Journal of Electronic Materials, no. 6 (2011): 1350-1363

Cited by22Bibtex

Complaint Cu-to-Cu electroless bonding for high- density off-chip interconnection

Hyochol Koo,Rajarshi Saha,Paul A Kohl

(2011)

Bibtex

Photodefinable Epoxycyclohexyl Polyhedral Oligomeric Silsesquioxane

Nathan Fritz,Rajarshi Saha,Sue Ann Bidstrup Allen,Paul A. Kohl

Journal of Electronic Materials, no. 2 (2010): 149-156

Cited by7Bibtex

Mawpyut intrusive complex of Jaintia hills district, Meghalaya, northeastern India: A case study for magmatic differentiation

Srinanda Chaudhuri,Rajarshi Saha,Jyotisankar Ray,S. K. Bhaduri

Journal of The Geological Society of India, no. 3 (2009): 385-394

Cited by4Bibtex

Structure-property relationships in the optimization of polysilicon thin films for electrical recording/stimulation of single neurons

Rajarshi Saha,Jit Muthuswamy

Biomedical microdevices, no. 3 (2007): 345-360

Cited by8WOSBibtex

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Rajarshi SahaBinding

Papers13 papers

Rajarshi Saha