Rajiv V. Joshi

Rajiv V. Joshi (Fellow, IEEE) received the B.Tech. degree from the Indian Institute of Technology Bombay, India, the M.S. degree from the Massachusetts Institute of Technology, and the Dr.Eng.Sc. degree from Columbia University. He has successfully led innovations in technology, memories (SRAM, DRAM, and others), and predictive analytic techniques for yield prediction for IBM Server Groups and their products. His statistical techniques are tailored for machine learning and AI which are licensed and commercialized. His memory innovations and work are used in both IBM P and Z servers. His technology innovations set IBM’s leadership across the globe. He received three Outstanding Technical Achievement (OTAs), three highest Corporate Patent Portfolio awards for contributions in interconnect technologies, holds 73 invention plateaus, has over 290 U.S. patents covering front end and back end of the line processes, and structures, volatile and non-volatile memories, compute in memory structures, machine learning algorithms, and quantum computing and over 425 international patents. He has authored and coauthored over 235 refereed articles, delivered over 60 invited/keynote talks, and given several seminars. He is a Mercator Fellow at the University of Siegen, Germany. He received the NY IP Law Association “Inventor of the Year” Award in February 2020. He is the winner of the prestigious IEEE Daniel Noble Award, and a Key Technical Lead/Research Scientist at T. J. Watson Research Center, IBM. He received the Industrial Pioneer Award in 2014 from the IEEE Circuits and Systems Society. He received the Best Editor Award from IEEE Transactions on Very Large Scale Integrati on Systems journal. He was inducted into the New Jersey Inventor Hall of Fame in August 2014. He won the Mehboob Khan Award two times from Semiconductor Research Corporation. He won several best paper awards from ISSCC 1992, VMIC 1998, ICCAD 2009, and ISQED 2014. He is a member of the IBM Academy of Technology and a master inventor. He serves on the Board of Governors for IEEE CAS as an Industrial Liaison. He served on EC for DAC, ISLPED, CICC, ISCAS, AICAS, and APCCAS (2023) committees as well as the AE of TCAS I and TVLSI. He served as a Distinguished Lecturer for IEEE CAS, CEDA, and EDS society. He is an ISQED and World Technology Network fellow and a distinguished alumnus of IIT Bombay. He served on the executive advisory committee for the Center of 3D Ferroelectric and Microelectronics at Penn State. He serves as an IEEE CAS Ambassador to India.