Sung K. Kang

IBM T.J. Watson Research Center Yorktown Heights NY

Show Academic Trajectory

Ego Network

D-Core

Research Interests

Author Statistics

Experience

Education

Bio

None

Papers53 papers

Sort

By YearBy Citation

Prevention and control of intermetallic alloy inclusions

S K Kang,Dayuan Shih, Yoonchul Son

(2014)

Bibtex

Effects of Sodium Citrate Concentration on Electroless Ni-Fe Bath Stability and Deposition

Myungwon Jung,S K Kang,Jaeho Lee

Journal of Electronic Materials, no. 1 (2013): 290-298

Cited by2Bibtex

Effects of Ti addition to Sn–Ag and Sn–Cu solders

W M Chen,S K Kang,C R Kao

Journal of Alloys and Compounds, (2012): 244-249

Cited by26Bibtex

Electromigration performance of Pb-free solder joints in terms of solder composition and joining path

Sun-Kyoung Seo,Sung K. Kang,Moon Gi Cho,Hyuck Mo Lee

JOM, no. 7 (2010): 22-29

Cited by18Bibtex

Foreword: Pb-Free Solders and Emerging Interconnect and Packaging Technologies

Kwang-Lung Lin,Sung K. Kang,Jenq-Gong Duh,Andre Lee,Thomas Bieler, Laura Turbini, Rajen Sidhu,Fu Guo,Iver Anderson

JOURNAL OF ELECTRONIC MATERIALS, no. SP12 (2010): 2503-2503

Bibtex

The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging

Sun-Kyoung Seo,Sung K. Kang,Da-Yuan Shih,Hyuck Mo Lee

Microelectronics Reliability, no. 3 (2009): 288-295

Cited by25EIBibtex

Effect of Zn doping on SnAg solder microstructure and electromigration stability

Minhua Lu,Dayuan Shih,S K Kang,C C Goldsmith,P Flaitz

Journal of Applied Physics, (2009)

Cited by20Bibtex

Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders

Moon Gi Cho,Sung K. Kang,Sun-Kyoung Seo,Da-Yuan Shih,Hyuck Mo Lee

Journal of Materials Research, no. 2 (2009): 534-543

Cited by13Bibtex

The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy

Sun-Kyoung Seo,Sung K. Kang,Moon Gi Cho,Da-Yuan Shih,Hyuck Mo Lee

Journal of Electronic Materials, no. 12 (2009): 2461-2469

Cited by26Bibtex

An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate

Sun-Kyoung Seo,Sung K. Kang,Da-Yuan Shih,Hyuck Mo Lee

Journal of Electronic Materials, no. 2 (2009): 257-265

Cited by31Bibtex

Special Issue: 2009 Pb-Free Solders - Foreword

Sung K. Kang,Iver Anderson, Srini Chada, Jeng-Gong Duh, Laura J. Turbini,Albert Wu,C. Robert Kao, Fay Hua,K. N. Subramanian, Darrel Frear,Carol Handwerker,Fu Guo

JOURNAL OF ELECTRONIC MATERIALS, no. 12 (2009): 2427-2428

Bibtex

An overview of Pb-free, flip-chip wafer-bumping technologies

Sung K. Kang,Peter Gruber,Da-Yuan Shih

JOM, no. 6 (2008): 66-70

Cited by16Bibtex

Undercooling and microhardness of Pb-free solders on various under bump metallurgies

Moon Gi Cho,Sung K. Kang,Hyuck Mo Lee

JOURNAL OF MATERIALS RESEARCH, no. 4 (2008): 1147-1154

Cited by24Bibtex

C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications

D Y Shih,Bing Dang,Petra Gruber,M Lu,Sungmo Kang,Stephen L Buchwalter,John U Knickerbocker,Eric D Perfecto,John J Garant,Sarah H Knickerbocker,Krystyna W Semkow,Brian R Sundlof

Shanghai, pp.1-7E, (2008)

Cited by4EIWOSBibtex

Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging

Moon Gi Cho,Sung K. Kang,Da-Yuan Shih,Hyuck Mo Lee

Journal of Electronic Materials, no. 11 (2007): 1501-1509

Cited by83Bibtex

3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections

Katsuyuki Sakuma,Paul S Andry,Bing Dang, J P Maria,Cornelia K Tsang,Chirag Patel,S L Wright,Bucknell C Webb,E Sprogis,S K Kang,R J Polastre,R Horton

Electronic Components and Technology Conference, pp.627-+, (2007)

Cited by51Bibtex

Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process

Sung K. Kang,M. G. Cho,P. Lauro,Da-Yuan Shih

JOURNAL OF MATERIALS RESEARCH, no. 3 (2007): 557-560

Cited by24Bibtex

Journal of Electronic Materials: Foreword

N. Chawla, Srinivas Chada,Sung K. Kang, C. Robert Kao, Kwang Lung Lin,J. P. Lucas,Laura J. Turbini

JOURNAL OF ELECTRONIC MATERIALS, no. SP12 (2006): 2073-2073

Bibtex

Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present

S K Kang,Dayuan Shih, Yoonchul Son

(2006)

Cited by3Bibtex

The influence of low level doping on the thermal evolution of SAC alloy solder joints with Cu pad structures

I De Sousa,Donald W Henderson, L G Parry,S K Kang,D Y Shih

Electronic Components and Technology Conference, pp.1454-+, (2006)

Cited by24Bibtex

View All

Base Info Papers Patents Projects

Sung K. KangBinding

Papers53 papers

Sung K. Kang