Sen-Hou Ko

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Papers49 papers

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APPARATUS AND METHODS FOR BRUSH AND PAD CONDITIONING

Senhou Ko, Lakshmanan Karuppiah

(2014)

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METHODS AND APPARATUS FOR POST-CHEMICAL MECHANICAL PLANARIZATION SUBSTRATE CLEANING

Senhou Ko, Lakshmanan Karuppiah

(2014)

Bibtex

CONDITIONING A PAD IN A CLEANING MODULE

Senhou Ko, Hui Chen

(2013)

Cited by2Bibtex

CLEANING MODULE AND PROCESS FOR PARTICLE REDUCTION

Senhou Ko, Lakshmanan Karuppiah

(2013)

Bibtex

Methods and apparatus for measuring substrate edge thickness during polishing

Dominic J Benvegnu, Boguslaw A Swedek,Senhou Ko, Abraham Ravid, Paul V Miller

(2012)

Cited by1Bibtex

Semiconductor substrate cleaning apparatus, systems, and methods

Yunshuang Ding,Senhou Ko

(2012)

Cited by2Bibtex

DISK-BRUSH CLEANER MODULE WITH FLUID JET

Hui Chen, Allen L Dambra,Senhou Ko, Yufei Chen, Adrian Blank, Mario D Silvetti, Gerald Alonzo, Lakshmanan Karuppiah

(2011)

Cited by4Bibtex

POLISHING PAD CONDITIONER

Hung Chih Chen,Senhou Ko, Shousung Chang

(2010)

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METHODS AND APPARATUS FOR POLISHING AN EDGE AND/OR NOTCH OF A SUBSTRATE

Gary C Ettinger, Paul D Butterfield, Antoine P Manens,Senhou Ko

(2010)

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Apparatus for conditioning processing pads

Paul D Butterfield,Senhou Ko

(2010)

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Method for conditioning processing pads

Paul D Butterfield,Senhou Ko

(2010)

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Post-CMP Cleaning of Copper/Hydrophobic Low-k Dielectric Films

Senhou Ko, Wenchiang Tu, Yuchun Wang, Kun Xu, Yufei Chen, Lakshmanan Karuppiah

(2009)

Cited by1Bibtex

METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE

Ho Seon Shin, Gary C Ettinger, Donald J K Olgado,Erik C Wasinger,Senhou Ko, Charles I Dodds, Yufei Chen, Weiyung Hsu

(2009)

Cited by13Bibtex

Wafer edge polishing process for defect reduction during immersion lithography

Motoya Okazaki, Raymond Maas,Senhou Ko, Yufei Chen, P P Miller, Mani Thothadri, Manjari Dutta,Chorngping Chang,Abraham Anapolsky, C Lazik, Y Uritsky,Martin Jay Seamons

Proceedings of SPIE, no. 1-2 (2008)

Cited by3Bibtex

METHODS AND APPARATUS FOR USING A ROLLING BACKING PAD FOR SUBSTRATE POLISHING

Eashwer Kollata, Shousung Chang, Zhenhua Zhang, Paul D Butterfield,Senhou Ko, Antoine P Manens, Gary C Ettinger, Ricardo Martinez

(2008)

Cited by6Bibtex

METHODS AND APPARATUS FOR CLEANING A SUBSTRATE EDGE USING CHEMICAL AND MECHANICAL POLISHING

Senhou Ko, Zhenhua Zhang, Yufei Chen, Weiyung Hsu

(2008)

Cited by3Bibtex

METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE BY SUBSTRATE VIBRATION

Zhenhua Zhang,Senhou Ko

(2008)

Cited by7Bibtex

METHODS AND APPARATUS FOR CONTROLLING THE SIZE OF AN EDGE EXCLUSION ZONE OF A SUBSTRATE

Zhenhua Zhang, Eashwer Kollata,Senhou Ko

(2008)

Cited by7Bibtex

METHODS AND APPARATUS TO CONTROL SUBSTRATE BEVEL AND EDGE POLISHING PROFILES OF FILMS

Zhenhua Zhang, Paul D Butterfield, Shousung Chang, Eashwer Kollata,Senhou Ko

(2008)

Cited by8Bibtex

METHODS AND APPARATUS FOR REMOVAL OF FILMS AND FLAKES FROM THE EDGE OF BOTH SIDES OF A SUBSTRATE USING BACKING PADS

Eashwer Kollata, Shousung Chang, Zhenhua Zhang, Paul D Butterfield,Senhou Ko, Antoine P Manens, Gary C Ettinger, Ricardo Martinez

(2008)

Cited by8Bibtex

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Sen-Hou KoBinding

Papers49 papers

Sen-Hou Ko