Ting Li(李婷)Senior Engineer

一种高介电常数的复合材料及其应用

孟鸿,曹菊鹏,闫丽佳,贺玉,魏潇赟,朱亚楠,李婷

Application Date: 20170615

Pressure gauge chip structure and preparation method thereof

YANG FANG,WANG WEI,ZHANG DACHENG,HUANG XIAN,HE JUN,ZHANG LI,LI TING,LUO KUI,WANG YING,JIANG BOYAN

Application Date: 20151209

Method for representing surface roughness of silicon wafer through utilization of current value

杨芳,张大成,何军,张立,刘鹏,王玮,李婷,罗葵,田大宇

Application Date: 20150902

Method for micro anchor leg torsion bonding strength by using thermal driving

何军,张大成,张立,杨芳,刘鹏,王玮,李婷,罗葵,田大宇

Application Date: 20150721

Method and system for extracting beam etching verticality

何军,张大成,张立,杨芳,刘鹏,王玮,李婷,罗葵,田大宇

Application Date: 20150721

Method and system for extracting tensile breaking strength of micro beam manufactured by bulk silicon process

何军,张大成,张立,王玮,杨芳,田大宇,刘鹏,李婷

Application Date: 20150312

Piezo-resistance type pressure meter chip structure and preparation method thereof

黄贤,杨芳,张大成,姜博岩,王玮,何军,田大宇,刘鹏,罗葵,李婷,张立

Application Date: 20150206

Chip structure of pressure gauge and manufacturing method of chip structure

黄贤,王玮,张大成,姜博岩,杨芳,何军,田大宇,刘鹏,罗葵,李婷,张立

Application Date: 20150206

Piezoresistive pressure meter chip structure and preparation method thereof

黄贤,刘鹏,张大成,姜博岩,王玮,何军,田大宇,杨芳,罗葵,李婷,张立

Application Date: 20150115

Electronic beam spot measuring method and device

刘鹏,张大成,王玮,田大宇,杨芳,罗葵,戴小涛,李婷,王颖,李静,时广轶

Application Date: 20140904

Method for detecting roughness of etched side walls through capacitance changes

张立,何军,张大成,黄贤,赵丹淇,王玮,杨芳,田大宇,刘鹏,李婷,罗葵

Application Date: 20140728

Wafer-level vacuum packaging method of bulk silicon resonant pressure transducer

何军,张大成,黄贤,张立,赵丹淇,王玮,杨芳,田大宇,刘鹏,李婷,罗葵

Application Date: 20140515

Method for preparing surface sacrificial layer of microelectronic mechanical system (MEMS) device by silicon-on-insulator (SOI) substrate

赵丹淇,张大成,何军,黄贤,杨芳,田大宇,刘鹏,王玮,李婷,罗葵

Application Date: 20140508

Method for detecting depth of etched groove through current change

张立,何军,张大成,黄贤,赵丹淇,王玮,杨芳,田大宇,刘鹏,李婷,罗葵

Application Date: 20140428

Method and device for detecting quality of etched surface by adopting breaking strength of surface

HE JUN,ZHANG DACHENG,HUANG XIAN,ZHANG LI,ZHAO DANQI,WANG WEI,YANG FANG,TIAN DAYU,LIU PENG,LI TING,LUO KUI

Application Date: 20140327

Novel silicon based super-capacitor and preparation method thereof

张立,张大成,何军,黄贤,赵丹淇,林琛,王玮,杨芳,田大宇,刘鹏,李婷,罗葵

Application Date: 20130411

Method for preparing self-packaging of MEMS (micro electro mechanical systems) device based on surface sacrificial layer technology

赵丹淇,张大成,何军,黄贤,杨芳,田大宇,刘鹏,王玮,李婷,罗葵

Application Date: 20130114

Self-packaged MEMS (micro-electro-mechanical systems) device and infrared sensor

赵丹淇,张大成,何军,黄贤,杨芳,田大宇,刘鹏,王玮,李婷,罗葵

Application Date: 20130114

Method for enhancing bonding strength of SOG (silicon on glass) process microstructure

何军,张大成,黄贤,赵丹淇,林琛,王玮,杨芳,田大宇,刘鹏,李婷,罗葵

Application Date: 20121129

MEMS piezoresistive pressure transducer without strain membrane structure and manufacture method thereof

黄贤,张大成,赵丹淇,林琛,何军,杨芳,田大宇,刘鹏,王玮,李婷,罗葵

Application Date: 20121129