Tuung Luoh

Technology Development Center, Macronix International Co. Ltd., No. 16, Li-Hsin Road, Science-Based Industrial Park, Hsinchu, Taiwan, ROC

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Papers79 papers

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STI scratch defects reduction by using solid pad in 1X technology node

K. C. Chen, Yen-Ting Chen, Chun-Fu Chen,Tuung Luoh, Lin-Wuu Yang,Tahone Yang,Kuang-Chao Chen, Yuchi Tay, Yi Ming Chen, Johnson Ton, Yen Pin Lu

china semiconductor technology international conference, (2018)

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Tungsten corrosion and recess improvement by feasible slurry and clean chemical in WCMP process

K. C. Chen, Chun-Fu Chen, Yung-Tai Hung,Tuung Luoh,Ling-Wuu Yang,Tahone Yang,Kuang-Chao Chen

international interconnect technology conference, pp.1-3, (2017)

Cited by1Bibtex

Overlay degradation induced by film stress

Chi-hao Huang, Yu-Lin Liu,Shing-Ann Luo, Mars Yang, Elvis Yang, Yung-Tai Hung,Tuung Luoh, T. H. Yang,K. C. Chen

Proceedings of SPIE, (2017)

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TiCl4 Barrier Process Engineering in Semiconductor Manufacturing

Tuung Luoh,Yukai Huang,Yungtai Hung,Lingwuu Yang,Tahone Yang,Kuangchao Chen

(2016)

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Pattern Damage and Slurry Behavior Analysis of CMP Process by Mechanical and Fluid Simulations-

Yisheng Cheng, Wencheng Yang,Shingann Luo,Yukai Huang,Yungtai Hung,Tuung Luoh, Linwuu Yang,Tahone Yang,Kuangchao Chen

(2015)

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APF hard mask distortion improvement for high aspect ratio patterning

Binglung Yu,Yukai Huang,Shingann Luo, Yisheng Cheng,Yungtai Hung,Tuung Luoh, Linwuu Yang,Tahone Yang,Kuangchao Chen

(2015)

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Slurry selectivity to local thickness variations control in advanced Cu CMP process

Tunghe Chou, Syueren Wu, Chunfu Chen,Yungtai Hung,Tuung Luoh,Lingwuu Yang,Tahone Yang,Kuangchao Chen

(2015)

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Inspection sensitivity improvement by wafer sort failure sites matching algorithm — Chimin Chen

Yiting Kuo,Hsiangchou Liao,Tuung Luoh,Lingwu Yang,Tahone Yang,Kuangchao Chen

(2015)

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METHOD FOR MEASURING AND ANALYZING SURFACE STRUCTURE OF CHIP OR WAFER

Tuung Luoh,Hsiangchou Liao,Lingwuu Yang,Tahone Yang,Kuangchao Chen

(2015)

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Pattern damage and slurry behavior analysis of CMP process by mechanical and fluid simulations-Yi-Sheng Cheng

Wencheng Yang,Shingann Luo,Yukai Huang,Yungtai Hung,Tuung Luoh, Linwuu Yang,Tahone Yang,Kuangchao Chen

(2015)

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The new methodology of contact process window vericification

Yilung Fang, Siaoling Li,Hsiangchou Liao,Tuung Luoh,Lingwu Yang,Tahone Yang,Kuangchao Chen

(2015)

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Tiny physical defects inspection by optimized EBI methodology

Hsiangchou Liao,Tuung Luoh,Lingwuu Yang,Tahone Yang,Kuangchao Chen,Chihyuan Lu, Donghua Liu, Rong Lv,Chingyun Hsiang, Chenmin Hu

e-Manufacturing and Design Collaboration Symposium, pp.1-3, (2014)

Cited by1EIWOSBibtex

Systematic Hot Spots Finding By Pattern Search with Similarity

Rong Lv,Tuung Luoh, C M Chen, K C Chen,Taek Ho Yang, C Y Lu, L W Yang, H C Liao

(2014)

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FOUP Mini-Environment Contaminants Analysis in Semiconductor Manufacturing -Yiting Kuo

Tuung Luoh,Lingwu Yang,Tahone Yang,Kuangchao Chen,Chihyuan Lu

(2014)

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3D interconnect simulation applied to CMP thickness variations

Tuung Luoh,Lingwu Yang,Tahone Yang,Kuangchao Chen,Chihyuan Lu, Shihao Huang, Kevin Lin, Shanchung Lee, Donghua Liu, Rong Lv,Chingyun Hsiang, Chenmin Hu

(2014)

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FOUP mini-environment contaminants analysis in semiconductor manufacturing

Yiting Kuo,Tuung Luoh,Lingwu Yang,Tahone Yang,Kuangchao Chen,Chihyuan Lu

e-Manufacturing and Design Collaboration Symposium, pp.1-3, (2014)

EIWOSBibtex

Smart Review Sampling Methodology in Huge Inspection Results

Tuung Luoh, Rong Lv, C M Chen, H C Liao, L W Yang, T H Yang, K C Chen, C Y Lu

(2014)

Cited by2Bibtex

Detecting buried voids in copper interconnect

Hsiangchou Liao,Tuung Luoh,Lingwu Yang,Tahone Yang,Kuangchao Chen,Chihyuan Lu, Steve Lin, Alex Cheng, Ivan Yao,Siyeul Yoon, O Moreau, Hong Xiao

e-Manufacturing & Design Collaboration Symposium, pp.1-4, (2013)

Cited by2EIWOSBibtex

Semiconductor device having plural conductive layers disposed within dielectric layer

Tuung Luoh,Chinta Su,Tahung Yang,Kuangchao Chen

(2013)

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In-line inspection yield prediction system

Hsiangchou Liao,Chelun Hung,Tuung Luoh,Lingwuu Yang,Tahone Yang,Kuangchao Chen

(2013)

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Papers79 papers

Tuung Luoh