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个人简介
His current research interests include 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, and imaging radar and computation systems.,Dr. Gu was a co-recipient of the IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and the IEEE JSSC 2017 Best Paper Award. He was also a co-recipient of the 2017 Pat Goldberg Memorial Award for the best paper in computer science, electrical engineering, and mathematics published by IBM Research. He was a recipient of the Best Session Paper Award at IEEE ECTC in 2007, the IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, the Best Conference Paper Award at IEEE EPEPS in 2011, four IBM Plateau Invention Awards from 2012 to 2016, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and 2014, the IEEE EMC Symposium Best Paper Award in 2013, and the IBM Outstanding Technical Achievement Award in 2016. He was the General Chair of IEEE EPEPS 2018, San Jose, CA, USA. He is also the Co-Chair of the Professional Interest Community (PIC) on Computer System Designs at IBM. He has been serving on the Program Committees of MTT-S, EPEPS, ECTC, EDAPS, and DesignCon. He is also a Distinguished Lecturer of the IEEE EMC Society (2019–2020). (Based on document published on 20 May 2019). Show Less
研究兴趣
论文共 100 篇作者统计合作学者相似作者
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2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI)pp.1543-1544, (2023)
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)pp.1590-1596, (2023)
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.467-474, (2023)
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1590-1596, (2023)
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2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI)pp.957-958, (2023)
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IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.2141-2147, (2022)
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.1144-1149, (2021)
IEEE Journal of Microwavesno. 1 (2021): 123-134
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