Yang Zhang

Binding

electrical performance of electronic packaging, (2018)

IEEE Transactions on Electron Devices, no. 12 (2018): 5460-5467

Electronic Components and Technology Conference, pp.1512-1518, (2018)

IEEE Electron Device Letters, no. 1 (2018): 99-102

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 10 (2017): 1617-1624

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 3 (2017): 434-443

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 7 (2017): 1101-1110

IEEE Transactions on Components, Packaging and Manufacturing Technology, (2016)

IEEE Transactions on Electron Devices, no. 3 (2016): 1225-1231

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 2 (2016): 192-199

ieee workshop on signal and power integrity, pp.1-4, (2016)

international interconnect technology conference, pp.83-85, (2016)

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 1 (2016): 31-39

IEEE Custom Integrated Circuits Conference, (2015)

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 10 (2015): 1379-1386

Electronic Components and Technology Conference, pp.828-832, (2015)

3DIC, (2014)

Thermal and Thermomechanical Phenomena in Electronic Systems, pp.205-212, (2014)