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个人简介
Zhekun Peng (Student Member, IEEE) received the B.S. degree in electronic and information engineering from the Huazhong University of Science and Technology, Wuhan, China, in 2019. He is currently working toward the Ph.D. degree in electrical engineering with Electromagnetic Compatibility Laboratory, Missouri University of Science and Technology, Rolla, MO, USA.
His research interests include electrostatic discharge measurement and modeling, on-chip ESD, system EMI measurement, and through-silicon via technology.
Mr. Peng was the recipient of the 2021 DesignCon Early-Career Best Paper Award.
研究兴趣
论文共 11 篇作者统计合作学者相似作者
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Yanxiao Li,Zhekun Peng,Jiaoli Li,Congjie Wei,Shangbin Liu,Weixing Hao,Huanyu Cheng, Casey Burton,Yang Wang,Yue-Wern Huang,Chang-Soo Kim, Fang Yao Stephen Hou,
ADVANCED MATERIALS TECHNOLOGIESno. 3 (2024)
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)pp.510-515, (2023)
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2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)pp.602-607, (2023)
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2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)pp.75-78, (2023)
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IEEE Transactions on Electromagnetic Compatibilityno. 6 (2022): 1802-1811
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposiumpp.119-124, (2021)
Hua Runbing, Hoseini Omid,Peng Zhekun, Shumiya Hideki, S. Konno, Koji Araki,Pommerenke David, Dong-Hyun Kim
IEEE Conference Proceedings (2020): 200-204
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