基本信息
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职业迁徙
个人简介
• 10 years’ experience of hardware process development, device physics research, device failure analysis (reliability), material characterization, electronic fabrication process and instrumentation.
• Deep understanding of solid state physics, materials science, circuit design and electronic device, with 1 book chapter (Book "Metrology and Diagnostic Techniques for Nanoelectronics"), 7 journal papers and 2 invited talks.
Skills:
• General engineering skills: R&D, DOE, SPC, JMP, FMEA
• Failure Analysis: Electrical Bench Tools, PVC, NanoProber, TEM, OBIRCH, FIB.
• Materials Characterization: AFM, TEM, SEM, EDS, XRD, FTIR, PL, UV, DSC, I-V, TGA, NMR.
• Instrumentation: LabVIEW (Automation, DAQ), Interfaces (GPIB, Serial), Vacuum System.
• Nanofabrication: PVD, CVD, UHV, RIE, CMP, lithography, wet etching, profilometer.
• Coding skills: C/C++, Matlab, Embedded System (8051, AVR), Python, Latex.
• Circuit Design/Assembly: Cadence, HSPICE, PCB level circuit assembly.
• Deep understanding of solid state physics, materials science, circuit design and electronic device, with 1 book chapter (Book "Metrology and Diagnostic Techniques for Nanoelectronics"), 7 journal papers and 2 invited talks.
Skills:
• General engineering skills: R&D, DOE, SPC, JMP, FMEA
• Failure Analysis: Electrical Bench Tools, PVC, NanoProber, TEM, OBIRCH, FIB.
• Materials Characterization: AFM, TEM, SEM, EDS, XRD, FTIR, PL, UV, DSC, I-V, TGA, NMR.
• Instrumentation: LabVIEW (Automation, DAQ), Interfaces (GPIB, Serial), Vacuum System.
• Nanofabrication: PVD, CVD, UHV, RIE, CMP, lithography, wet etching, profilometer.
• Coding skills: C/C++, Matlab, Embedded System (8051, AVR), Python, Latex.
• Circuit Design/Assembly: Cadence, HSPICE, PCB level circuit assembly.
研究兴趣
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Nano lettersno. 10 (2023): 4587-4594
Advanced Materials Interfacesno. 23 (2022)
METROLOGY AND DIAGNOSTIC TECHNIQUES FOR NANOELECTRONICS (2017)
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