Front End Electronic Building Blocks for CBM

msra

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摘要
The CBM experiment will require novel electronics for sensor readout and fast data communication. Several proto- typing designs and test structures in the UMC 0.18µm tar- get technology have been put together by the groups con- tributing to the development of chip-level electronics for CBM. The multi project run has been financed by GSI. Ex- amples of submitted structures are a fast ADC, clock/data recovery circuits, a content addressable memory, charge sensitive preamplifiers for micro strip detectors, time-to- digital converters, DACs and transistor test structures.
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