Ultra-Thin, Flexible Electronics

2008.

Cited by: 0|Bibtex|Views0|DOI:https://doi.org/10.1109/ECTC.2008.4550114
Other Links: academic.microsoft.com

Abstract:

Thinned die can be used to realize ultra-thin flexible electronics for applications such as conformal and wearable electronics. Three techniques have been developed to achieve this goal using thinned die: die flip chip bonded onto flexible substrates, die laminated onto LCP films, and die embedded in polyimide. A key to achieving each of ...More

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