Power Optimization For Application-Specific 3d Network-On-Chip With Multiple Supply Voltages

2013 18TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC)（2013）

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摘要

In this paper, a MSV-driven power optimization method is proposed for application-specific 3D NoC (MSV-3DNoC). A unified modeling method is presented for considering both layer assignment and voltage assignment, which achieves the best trade-off between core power and communication power. A 3D NoC synthesis is proposed to assign network components onto each layer and generate inter-layer interconnection. A global redistribution is applied to further reduce communication power. Experimental results show that compared to MSV-driven 2D NoC, the proposed method can improve total chip power greatly.

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关键词

application specific integrated circuits,integrated circuit design,network operating systems,network-on-chip,optimisation,three-dimensional integrated circuits,3D NoC synthesis,MSV-3DNoC,application specific 3D network-on-chip,global redistribution,interlayer interconnection,layer assignment,multiple supply voltage,power optimization,unified modeling method,voltage assignment,

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